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Patent applications and USPTO patent grants for MEYYAPPAN; Karumbu.The latest application filed is for "low force liquid metal interconnect solutions".
Patent | Date |
---|---|
Low Force Liquid Metal Interconnect Solutions App 20210392774 - MEYYAPPAN; Karumbu ;   et al. | 2021-12-16 |
Double-beam Test Probe App 20200096567 - Diglio; Paul J. ;   et al. | 2020-03-26 |
Connector port frame for processor package Grant 10,109,940 - Boyd , et al. October 23, 2 | 2018-10-23 |
Universal linear edge connector Grant 10,044,115 - Tran , et al. August 7, 2 | 2018-08-07 |
Connector Port Frame For Processor Package App 20180166807 - BOYD; THOMAS A. ;   et al. | 2018-06-14 |
Linear edge connector with activator bar and contact load spring Grant 9,859,636 - Boyd , et al. January 2, 2 | 2018-01-02 |
Linear edge connector with activator bar and contact load spring App 20170187134 - Boyd; Thomas A. ;   et al. | 2017-06-29 |
Universal linear edge connector App 20170187147 - Tran; Donald T. ;   et al. | 2017-06-29 |
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