Meyers; John Paul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Meyers; John Paul.The latest application filed is for "use of photoresist material as an interstitial fill for pzt printhead fabrication".
- Meyers; John Paul - Rochester NY
| Patent | Date |
|---|---|
| Use of photoresist material as an interstitial fill for PZT printhead fabrication Grant 8,550,601 - Cellura , et al. October 8, 2 | 2013-10-08 |
| Use Of Photoresist Material As An Interstitial Fill For Pzt Printhead Fabrication App 20120242758 - Cellura; Mark A. ; et al. | 2012-09-27 |
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