Meyers; John P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Meyers; John P..The latest application filed is for "system and method to attenuate the drying of aqueous inks in a printhead".

Company Profile

0.13.14

Meyers; John P. - Penfield NY
Meyers; John P. - Rochester NY US
Meyers; John P. - Manitowoc WI

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System and method to detect ink drop directionality degradation and perform remedial measures to prevent failing inkjets in printheads Grant 11,059,289 - Praharaj , et al. July 13, 2	2021-07-13
System And Method To Detect Ink Drop Directionality Degradation And Perform Remedial Measures To Prevent Failing Inkjets In Printheads App 20210187948 - Praharaj; Seemit ; et al.	2021-06-24
System And Method To Attenuate The Drying Of Aqueous Inks In A Printhead App 20210187953 - Liu; Chu-Heng ; et al.	2021-06-24
Optimizing MICR ink usage with multiple ink droplet sizes Grant 10,105,979 - Hoover , et al. October 23, 2	2018-10-23
Print head transducer dicing directly on diaphragm Grant 9,139,004 - Redding , et al. September 22, 2	2015-09-22
Connection Assembly For A Base And A Cabinet Assembly Of An Ice Maker App 20140015393 - Meyers; John P. ; et al.	2014-01-16
Print Head Transducer Dicing Directly On Diaphragm App 20130227826 - Redding; Gary D. ; et al.	2013-09-05
Cast-in place ink feed structure using encapsulant Grant 8,235,500 - Nystrom , et al. August 7, 2	2012-08-07
Method for modular arrangement of a silicon based array and modular silicon based array Grant 8,182,069 - Cellura , et al. May 22, 2	2012-05-22
Maintainable coplanar front face for silicon die array printhead Grant 8,132,892 - Nystrom , et al. March 13, 2	2012-03-13
Method For Modular Arrangement Of A Silicon Based Array And Modular Silicon Based Array App 20120018838 - Cellura; Mark A. ; et al.	2012-01-26
Inkjet printed wirebonds, encapsulant and shielding Grant 8,097,497 - Gulvin , et al. January 17, 2	2012-01-17
Method for modular arrangement of a silicon based array and modular silicon based array Grant 8,087,753 - Cellura , et al. January 3, 2	2012-01-03
Method For Modular Arrangement Of A Silicon Based Array And Modular Silicon Based Array App 20110175219 - CELLURA; Mark A. ; et al.	2011-07-21
Cast-in Place Ink Feed Structure Using Encapsulant App 20100214361 - Nystrom; Peter J. ; et al.	2010-08-26
Method of manufacturing a cast-in place ink feed structure using encapsulant Grant 7,735,225 - Nystrom , et al. June 15, 2	2010-06-15
Self-aligned precision datums for array die placement Grant 7,681,985 - Nystrom , et al. March 23, 2	2010-03-23
Maintainable Coplanar Front Face For Silicon Die Array Printhead App 20090289994 - NYSTROM; Peter J. ; et al.	2009-11-26
Maintainable coplanar front face for silicon die array printhead Grant 7,591,535 - Nystrom , et al. September 22, 2	2009-09-22
Self-aligned Precision Datums For Array Die Placement App 20090201328 - NYSTROM; Peter J. ; et al.	2009-08-13
Self-aligned precision datums for array die placement Grant 7,571,970 - Nystrom , et al. August 11, 2	2009-08-11
Maintainable Coplanar Front Face for Silicon Die Array Printhead App 20090046125 - Nystrom; Peter J. ; et al.	2009-02-19
Self-aligned Precision Datums For Array Die Placement App 20090014413 - NYSTROM; Peter J. ; et al.	2009-01-15
Cast-in Place Ink Feed Structure Using Encapsulant App 20080239002 - Nystrom; Peter J. ; et al.	2008-10-02
Inkjet Printed Wirebonds, Encapsulant And Shielding App 20080242004 - Gulvin; Peter M. ; et al.	2008-10-02

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