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Patent applications and USPTO patent grants for MEYERS; Alan M..The latest application filed is for "method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme".
Patent | Date |
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Method And Structure To Contact Tight Pitch Conductive Layers With Guided Vias Using Alternating Hardmasks And Encapsulating Etchstop Liner Scheme App 20170330761 - CHAWLA; Jasmeet S. ;   et al. | 2017-11-16 |
Forming barrier walls, capping, or alloys /compounds within metal lines Grant 9,659,869 - Jezewski , et al. May 23, 2 | 2017-05-23 |
Forming Barrier Walls, Capping, Or Alloys /compounds Within Metal Lines App 20140091467 - Jezewski; Christopher J. ;   et al. | 2014-04-03 |
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