Meyer; Todd W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Meyer; Todd W..The latest application filed is for "closure and container package with rfid circuit".
- Meyer; Todd W. - Ottawa OH
| Patent | Date |
|---|---|
| Closure and container package with RFID circuit Grant 7,479,887 - Meyer January 20, 2 | 2009-01-20 |
| Manufacture of plastic containers having internal identifying indicia molded on a container wall Grant 7,455,808 - Meyer , et al. November 25, 2 | 2008-11-25 |
| Closure and container package with RFID circuit App 20080068179 - Meyer; Todd W. | 2008-03-20 |
| Closure and container package with RFID circuit App 20080068178 - Meyer; Todd W. | 2008-03-20 |
| Container base Grant D551,980 - Meyer October 2, 2 | 2007-10-02 |
| Manufacture of plastic containers having internal identifying indicia molded on a container wall App 20060255235 - Meyer; Todd W. ; et al. | 2006-11-16 |
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