MEYER; Katja
Patent Applications and Registrations
Patent applications and USPTO patent grants for MEYER; Katja.The latest application filed is for "diecut especially for permanently closing holes".
- MEYER; Katja - Hamburg DE
| Patent | Date |
|---|---|
| Diecut Especially For Permanently Closing Holes App 20220105708 - MEYER; Katja ; et al. | 2022-04-07 |
| Stanzling insbesondere zum dauerhaften Verschlie en von Lochern App 20220025220 - MEYER; Katja ; et al. | 2022-01-27 |
| Thermally vulcanisable adhesive and adhesive strip produced therefrom Grant 11,208,581 - Dietze , et al. December 28, 2 | 2021-12-28 |
| Diecut, in particular for permanently closing holes Grant 10,946,629 - Meyer , et al. March 16, 2 | 2021-03-16 |
| Diecut, In Particular For Permanently Closing Holes App 20190352540 - MEYER; Katja ; et al. | 2019-11-21 |
| Thermally Vulcanisable Adhesive And Adhesive Strip Produced Therefrom App 20190218436 - DIETZE; Sebastian ; et al. | 2019-07-18 |
| Blank, In Particular For Permanently Closing Holes App 20160200075 - DIETZE; SEBASTIAN ; et al. | 2016-07-14 |
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