Mevellec; Vincent

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mevellec; Vincent.The latest application filed is for "electrodeposition of a cobalt or copper alloy, and use in microelectronics".

Company Profile

3.21.17

Mevellec; Vincent - Boulogne Billancourt FR
MEVELLEC; Vincent - Boulogne FR
Mevellec; Vincent - Chaville FR
Mevellec; Vincent - Orsay N/A FR
MEVELLEC; Vincent - Bouloyre-Billancourt FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process for electrodeposition of cobalt Grant 11,384,445 - Mevellec , et al. July 12, 2	2022-07-12
Electrodeposition Of A Cobalt Or Copper Alloy, And Use In Microelectronics App 20220090283 - MEVELLEC; Vincent ; et al.	2022-03-24
Process For Electrodeposition Of Cobalt App 20210079547 - MEVELLEC; Vincent ; et al.	2021-03-18
Copper electrodeposition solution and process for high aspect ratio patterns Grant 10,883,185 - Religieux , et al. January 5, 2	2021-01-05
Electrolyte and process for electroplating copper onto a barrier layer Grant 10,472,726 - Mevellec , et al. Nov	2019-11-12
Copper Electrodeposition Solution And Process For High Aspect Ratio Patterns App 20180363158 - RELIGIEUX; Laurianne ; et al.	2018-12-20
Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit Grant 9,790,371 - Mevellec , et al. October 17, 2	2017-10-17
Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit Grant 9,790,370 - Mevellec , et al. October 17, 2	2017-10-17
Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit Grant 9,725,602 - Mevellec , et al. August 8, 2	2017-08-08
Method for forming a metal silicide using a solution containing gold ions and fluorine ions Grant 9,564,333 - Mevellec , et al. February 7, 2	2017-02-07
Method For Forming A Metal Silicide Using A Solution Containing Gold Ions And Fluorine Ions App 20150380254 - MEVELLEC; Vincent ; et al.	2015-12-31
Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method Grant 9,190,283 - Mevellec , et al. November 17, 2	2015-11-17
Solution and process for activating the surface of a semiconductor substrate Grant 9,181,623 - Mevellec , et al. November 10, 2	2015-11-10
Electrolyte And Process For Electroplating Copper Onto A Barrier Layer App 20150218724 - Mevellec; Vincent ; et al.	2015-08-06
Solution and method for activating the oxidized surface of a semiconductor substrate Grant 8,883,641 - Mevellec , et al. November 11, 2	2014-11-11
Method for preparing an organic film at the surface of solid support under non-electrochemical conditions, solid support thus obtained and preparation kit Grant 8,709,542 - Mevellec , et al. April 29, 2	2014-04-29
Method For Forming A Vertical Electrical Connection In A Layered Semiconductor Structure App 20140084474 - Suhr; Dominique ; et al.	2014-03-27
Method Of Depositing Metallic Layers Based On Nickel Or Cobalt On A Semiconducting Solid Substrate; Kit For Application Of Said Method App 20140087560 - Mevellec; Vincent ; et al.	2014-03-27
Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method Grant 8,524,512 - Mevellec September 3, 2	2013-09-03
Solution And Method For Activating The Oxidized Surface Of A Semiconductor Substrate App 20120196441 - Mevellec; Vincent ; et al.	2012-08-02
Solution And Process For Activating The Surface Of A Semiconductor Substrate App 20120156892 - Mevellec; Vincent ; et al.	2012-06-21
Method of preparing an electrically insulating film and application for the metallization of vias Grant 8,119,542 - Mevellec , et al. February 21, 2	2012-02-21
Method For Repairing Copper Diffusion Barrier Layers On A Semiconductor Solid Substrate And Repair Kit For Implementing This Method App 20110294231 - Mevellec; Vincent	2011-12-01
Method Of Preparing An Electrically Insulating Film And Application For The Metallization Of Vias App 20100003808 - MEVELLEC; Vincent ; et al.	2010-01-07
Method For Preparing An Organic Film At The Surface Of A Solid Support Under Non-electrochemical Conditions, Solid Support Thus Obtained And Preparation Kit App 20090117391 - Mevellec; Vincent ; et al.	2009-05-07
Method For Preparing An Organic Film At The Surface Of A Solid Support Under Non-electrochemical Conditions, Solid Support Thus Obtained And Preparation Kit App 20080193668 - Mevellec; Vincent ; et al.	2008-08-14
Method For Preparing An Organic Film At The Surface Of A Solid Support Under Non-electrochemical Conditions, Solid Support Thus Obtained And Preparation Kit App 20080152949 - MEVELLEC; Vincent ; et al.	2008-06-26
Method For Preparing An Organic Film At The Surface Of Solid Support Under Non-electrochemical Conditions, Solid Support Thus Obtained And Preparation Kit App 20080145706 - Mevellec; Vincent ; et al.	2008-06-19

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