| Patent | Date |
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Method for fabricating a semiconductor device including self-aligned top via formation at line ends
Grant 11,404,317 - Arnold , et al. August 2, 2 | 2022-08-02 |
Polymerization Protective Liner For Reactive Ion Etch In Patterning
App 20220238349 - Nagabhirava; Bhaskar ; et al. | 2022-07-28 |
Selective Patterning Of Vias With Hardmasks
App 20220165612 - Arnold; John C. ; et al. | 2022-05-26 |
Pillar-based Memory Hardmask Smoothing And Stress Reduction
App 20220109099 - Rizzolo; Michael ; et al. | 2022-04-07 |
Selective patterning of vias with hardmasks
Grant 11,276,607 - Arnold , et al. March 15, 2 | 2022-03-15 |
Metal surface preparation for increased alignment contrast
Grant 11,244,907 - Zhou , et al. February 8, 2 | 2022-02-08 |
Placing Top Vias At Line Ends By Selective Growth Of Via Mask From Line Cut Dielectric
App 20220028784 - DUTTA; Ashim ; et al. | 2022-01-27 |
MRAM integration with BEOL interconnect including top via
Grant 11,227,892 - Dutta , et al. January 18, 2 | 2022-01-18 |
Pillar-based memory hardmask smoothing and stress reduction
Grant 11,223,008 - Rizzolo , et al. January 11, 2 | 2022-01-11 |
Embedded MRAM device with top via
Grant 11,205,678 - Dutta , et al. December 21, 2 | 2021-12-21 |
Self-aligned top vias over metal lines formed by a damascene process
Grant 11,189,527 - Philip , et al. November 30, 2 | 2021-11-30 |
Embedded MRAM device formation with self-aligned dielectric cap
Grant 11,189,783 - Arnold , et al. November 30, 2 | 2021-11-30 |
Placing top vias at line ends by selective growth of via mask from line cut dielectric
Grant 11,189,561 - Dutta , et al. November 30, 2 | 2021-11-30 |
Self-aligned top via formation at line ends
Grant 11,152,261 - Dutta , et al. October 19, 2 | 2021-10-19 |
Self-aligned top via
Grant 11,133,260 - Liu , et al. September 28, 2 | 2021-09-28 |
Self-aligned Top Vias Over Metal Lines Formed By A Damascene Process
App 20210296169 - Philip; Timothy Mathew ; et al. | 2021-09-23 |
Structurally Stable Self-Aligned Subtractive Vias
App 20210280465 - Mukesh; Sagarika ; et al. | 2021-09-09 |
Structurally stable self-aligned subtractive vias
Grant 11,094,590 - Mukesh , et al. August 17, 2 | 2021-08-17 |
Embedded MRAM Device with Top Via
App 20210242277 - Dutta; Ashim ; et al. | 2021-08-05 |
Metal Surface Preparation For Increased Alignment Contrast
App 20210210434 - Zhou; Tianji ; et al. | 2021-07-08 |
Pillar-based Memory Hardmask Smoothing And Stress Reduction
App 20210159394 - Rizzolo; Michael ; et al. | 2021-05-27 |
Self-aligned Top Via
App 20210151377 - Liu; Chi-Chun ; et al. | 2021-05-20 |
Self-Aligned Top Via Formation at Line Ends
App 20210125865 - Dutta; Ashim ; et al. | 2021-04-29 |
Embedded Mram Device Formation With Self-aligned Dielectric Cap
App 20210091301 - Arnold; John ; et al. | 2021-03-25 |
Self-aligned Top Via Formation At Line Ends
App 20210090951 - Arnold; John C. ; et al. | 2021-03-25 |
Selective Patterning Of Vias With Hardmasks
App 20210082746 - Arnold; John C. ; et al. | 2021-03-18 |
Placing Top Vias At Line Ends By Selective Growth Of Via Mask From Line Cut Dielectric
App 20210082807 - DUTTA; Ashim ; et al. | 2021-03-18 |
Patterning integration scheme with trench alignment marks
Grant 10,879,190 - Yang , et al. December 29, 2 | 2020-12-29 |
Mram Integration With Beol Interconnect Including Top Via
App 20200403032 - Dutta; Ashim ; et al. | 2020-12-24 |
Patterning Integration Scheme With Trench Alignment Marks
App 20200350257 - Yang; Chih-Chao ; et al. | 2020-11-05 |
Lithographic alignment of a conductive line to a via
Grant 10,685,879 - Arnold , et al. | 2020-06-16 |
Lithographic photomask alignment using non-planar alignment structures formed on wafer
Grant 10,534,276 - Yang , et al. Ja | 2020-01-14 |
Reactor for plasma-based atomic layer etching of materials
Grant 9,620,382 - Oehrlein , et al. April 11, 2 | 2017-04-11 |
Reactor For Plasma-based Atomic Layer Etching Of Materials
App 20150162168 - OEHRLEIN; Gottlieb S. ; et al. | 2015-06-11 |
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