Metz; Andrew W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Metz; Andrew W..The latest application filed is for "high aspect ratio via etch using atomic layer deposition protection layer".

Company Profile

1.13.12

Metz; Andrew W. - Watervliet NY
Metz; Andrew W. - Loundonville NY US
METZ; Andrew W. - Loudonville NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High aspect ratio via etch using atomic layer deposition protection layer Grant 11,121,027 - Lu , et al. September 14, 2	2021-09-14
Method for reducing reactive ion etch lag in low K dielectric etching Grant 10,854,453 - Raley , et al. December 1, 2	2020-12-01
Method of quasi atomic layer etching Grant 10,438,797 - Cottle , et al. O	2019-10-08
Method for patterning a substrate using a layer with multiple materials Grant 10,332,744 - deVilliers , et al.	2019-06-25
High Aspect Ratio Via Etch Using Atomic Layer Deposition Protection Layer App 20190181041 - Lu; Yen-Tien ; et al.	2019-06-13
Method For Reducing Reactive Ion Etch Lag in Low K Dielectric Etching App 20180358227 - Raley; Angelique D. ; et al.	2018-12-13
Method of Quasi Atomic Layer Etching App 20180068852 - Cottle; Hongyun ; et al.	2018-03-08
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) Grant 9,818,610 - Matsumoto , et al. November 14, 2	2017-11-14
Method for Patterning a Substrate Using a Layer with Multiple Materials App 20170316939 - deVilliers; Anton J. ; et al.	2017-11-02
Trench And Hole Patterning With Euv Resists Using Dual Frequency Capacitively Coupled Plasma (ccp) App 20170263443 - Matsumoto; Hiroie ; et al.	2017-09-14
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) Grant 9,607,834 - Matsumoto , et al. March 28, 2	2017-03-28
Trench And Hole Patterning With Euv Resists Using Dual Frequency Capacitively Coupled Plasma (ccp) App 20160293405 - Matsumoto; Hiroie ; et al.	2016-10-06
Self-aligned patterning using directed self-assembly of block copolymers Grant 9,396,958 - Metz , et al. July 19, 2	2016-07-19
Self-Aligned Patterning using Directed Self-Assembly of Block Copolymers App 20160104628 - Metz; Andrew W. ; et al.	2016-04-14
Dry metal etching method Grant 8,808,562 - Ohsawa , et al. August 19, 2	2014-08-19
Selective etch process for silicon nitride Grant 8,501,630 - Metz , et al. August 6, 2	2013-08-06
Dry Metal Etching Method App 20130065398 - OHSAWA; Yusuke ; et al.	2013-03-14
Method for high aspect ratio patterning in a spin-on layer Grant 8,382,997 - Metz February 26, 2	2013-02-26
Selective etch process for silicon nitride App 20120077347 - METZ; Andrew W. ; et al.	2012-03-29
Method for high aspect ratio patterning in a spin-on layer App 20120037592 - METZ; Andrew W.	2012-02-16
Process for etching anti-reflective coating to improve roughness, selectivity and CD shrink App 20100216310 - METZ; Andrew W. ; et al.	2010-08-26

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