loadpatents
name:-0.014137029647827
name:-0.0097620487213135
name:-0.0018649101257324
Metral; Frederic Patent Filings

Metral; Frederic

Patent Applications and Registrations

Patent applications and USPTO patent grants for Metral; Frederic.The latest application filed is for "equipment for bonding by molecular adhesion".

Company Profile
0.8.9
  • Metral; Frederic - St. Quentin sur Isere FR
  • Metral; Frederic - Saint Hilaire du Touvet FR
  • Metral; Frederic - St. Quantin sur Isere FR
  • Metral; Frederic - Saint-Quentin sur Isere FR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Process for bonding by molecular adhesion
Grant 8,158,013 - Kerdiles , et al. April 17, 2
2012-04-17
Equipment for bonding by molecular adhesion
Grant 8,091,601 - Kerdiles , et al. January 10, 2
2012-01-10
Methods for preparing a bonding surface of a semiconductor wafer
Grant 7,919,391 - Delattre , et al. April 5, 2
2011-04-05
Planarization of a heteroepitaxial layer
Grant 7,718,534 - Martinez , et al. May 18, 2
2010-05-18
Equipment For Bonding By Molecular Adhesion
App 20090294072 - Kerdiles; Sebastien ;   et al.
2009-12-03
Process For Bonding By Molecular Adhesion
App 20090261064 - Kerdiles; Sebastien ;   et al.
2009-10-22
Process and equipment for bonding by molecular adhesion
Grant 7,601,271 - Kerdiles , et al. October 13, 2
2009-10-13
Process and equipment for bonding by molecular adhesion
App 20070119812 - Kerdiles; Sebastien ;   et al.
2007-05-31
Planarization Of A Heteroepitaxial Layer
App 20070087570 - Martinez; Muriel ;   et al.
2007-04-19
Methods for forming semiconductor structures
App 20060141746 - Delattre; Cecile ;   et al.
2006-06-29
Method for recycling a substrate
Grant 7,022,586 - Maleville , et al. April 4, 2
2006-04-04
Surface preparation for receiving processing treatments
Grant 6,988,936 - Filipozzi , et al. January 24, 2
2006-01-24
Method for automatically determining the surface quality of a bonding interface between two wafers
Grant 6,881,596 - Malville , et al. April 19, 2
2005-04-19
Method for recycling a substrate
App 20040112866 - Maleville, Christophe ;   et al.
2004-06-17
Surface preparation for receiving processing treatments
App 20040058626 - Filipozzi, Laurent ;   et al.
2004-03-25
Device and method for automatically determining the surface quality of a bonding interface between two wafers
App 20040005727 - Malville, Christophe ;   et al.
2004-01-08
Chemical-mechanical polishing machine for polishing a wafer of material, and an abrasive delivery device fitted to such a machine
App 20030194948 - Metral, Frederic
2003-10-16

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