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Patent applications and USPTO patent grants for Metral; Frederic.The latest application filed is for "equipment for bonding by molecular adhesion".
Patent | Date |
---|---|
Process for bonding by molecular adhesion Grant 8,158,013 - Kerdiles , et al. April 17, 2 | 2012-04-17 |
Equipment for bonding by molecular adhesion Grant 8,091,601 - Kerdiles , et al. January 10, 2 | 2012-01-10 |
Methods for preparing a bonding surface of a semiconductor wafer Grant 7,919,391 - Delattre , et al. April 5, 2 | 2011-04-05 |
Planarization of a heteroepitaxial layer Grant 7,718,534 - Martinez , et al. May 18, 2 | 2010-05-18 |
Equipment For Bonding By Molecular Adhesion App 20090294072 - Kerdiles; Sebastien ;   et al. | 2009-12-03 |
Process For Bonding By Molecular Adhesion App 20090261064 - Kerdiles; Sebastien ;   et al. | 2009-10-22 |
Process and equipment for bonding by molecular adhesion Grant 7,601,271 - Kerdiles , et al. October 13, 2 | 2009-10-13 |
Process and equipment for bonding by molecular adhesion App 20070119812 - Kerdiles; Sebastien ;   et al. | 2007-05-31 |
Planarization Of A Heteroepitaxial Layer App 20070087570 - Martinez; Muriel ;   et al. | 2007-04-19 |
Methods for forming semiconductor structures App 20060141746 - Delattre; Cecile ;   et al. | 2006-06-29 |
Method for recycling a substrate Grant 7,022,586 - Maleville , et al. April 4, 2 | 2006-04-04 |
Surface preparation for receiving processing treatments Grant 6,988,936 - Filipozzi , et al. January 24, 2 | 2006-01-24 |
Method for automatically determining the surface quality of a bonding interface between two wafers Grant 6,881,596 - Malville , et al. April 19, 2 | 2005-04-19 |
Method for recycling a substrate App 20040112866 - Maleville, Christophe ;   et al. | 2004-06-17 |
Surface preparation for receiving processing treatments App 20040058626 - Filipozzi, Laurent ;   et al. | 2004-03-25 |
Device and method for automatically determining the surface quality of a bonding interface between two wafers App 20040005727 - Malville, Christophe ;   et al. | 2004-01-08 |
Chemical-mechanical polishing machine for polishing a wafer of material, and an abrasive delivery device fitted to such a machine App 20030194948 - Metral, Frederic | 2003-10-16 |
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