Mess; Leonard E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mess; Leonard E..The latest application filed is for "semiconductor devices including semiconductor dice in laterally offset stacked arrangement".

Company Profile

0.42.32

Mess; Leonard E. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of fabrication thereof Grant 8,049,342 - Mess , et al. November 1, 2	2011-11-01
Semiconductor device assemblies, electronic devices including the same and assembly methods Grant 7,998,792 - Mess , et al. August 16, 2	2011-08-16
Semiconductor devices including semiconductor dice in laterally offset stacked arrangement Grant 7,999,378 - Mess , et al. August 16, 2	2011-08-16
Stackable ceramic FBGA for high thermal applications Grant 7,829,991 - Moden , et al. November 9, 2	2010-11-09
Semiconductor Devices Including Semiconductor Dice In Laterally Offset Stacked Arrangement App 20100148331 - Mess; Leonard E. ; et al.	2010-06-17
Method of forming a semiconductor device Grant 7,704,794 - Mess , et al. April 27, 2	2010-04-27
Semiconductor Device Assemblies, Electronic Devices Including The Same And Assembly Methods App 20100078793 - Mess; Leonard E. ; et al.	2010-04-01
Stacked Mass Storage Flash Memory Package App 20090286356 - Mess; Leonard E. ; et al.	2009-11-19
Assembly for stacked BGA packages Grant 7,408,255 - Corisis , et al. August 5, 2	2008-08-05
Module assembly for stacked BGA packages Grant 7,400,032 - Corisis , et al. July 15, 2	2008-07-15
Module assembly and method for stacked BGA packages Grant 7,396,702 - Corisis , et al. July 8, 2	2008-07-08
Stacked mass storage flash memory package Grant 7,375,419 - Mess , et al. May 20, 2	2008-05-20
Stackable Ceramic Fbga For High Thermal Applications App 20080042252 - Moden; Walter L. ; et al.	2008-02-21
Stackable ceramic FBGA for high thermal applications Grant 7,285,442 - Moden , et al. October 23, 2	2007-10-23
Module assembly and method for stacked BGA packages Grant 7,279,797 - Corisis , et al. October 9, 2	2007-10-09
Stacked mass storage flash memory package Grant 7,262,506 - Mess , et al. August 28, 2	2007-08-28
Alignment and orientation features for a semiconductor package Grant 7,229,905 - Roberts , et al. June 12, 2	2007-06-12
Stacked mass storage flash memory package App 20070065987 - Mess; Leonard E. ; et al.	2007-03-22
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board Grant 7,166,252 - Gochnour , et al. January 23, 2	2007-01-23
Module assembly and method for stacked BGA packages App 20060060957 - Corisis; David J. ; et al.	2006-03-23
Module assembly and method for stacked BGA packages App 20060051953 - Corisis; David J. ; et al.	2006-03-09
Module assembly and method for stacked BGA packages App 20060049504 - Corisis; David J. ; et al.	2006-03-09
Alignment and orientation features for a semiconductor package App 20050148116 - Roberts, Stuart L. ; et al.	2005-07-07
Stackable ceramic FBGA for high thermal applications App 20050146010 - Moden, Walter L. ; et al.	2005-07-07
Stacked mass storage flash memory package Grant 6,900,528 - Mess , et al. May 31, 2	2005-05-31
Module assembly and method for stacked BGA packages App 20050110135 - Corisis, David J. ; et al.	2005-05-26
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board App 20050087909 - Gochnour, Derek J. ; et al.	2005-04-28
Alignment and orientation features for a semiconductor package Grant 6,869,869 - Roberts , et al. March 22, 2	2005-03-22
System for electronically coupling a device to an electrical apparatus Grant 6,864,700 - Mess March 8, 2	2005-03-08
Stackable ceramic FBGA for high thermal applications Grant 6,858,926 - Moden , et al. February 22, 2	2005-02-22
Stacked mass storage flash memory package App 20050029645 - Mess, Leonard E. ; et al.	2005-02-10
Module assembly for stacked BGA packages Grant 6,838,768 - Corisis , et al. January 4, 2	2005-01-04
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board Grant 6,830,719 - Gochnour , et al. December 14, 2	2004-12-14
Encapsulation method in a molding machine for an electronic device Grant 6,815,261 - Mess November 9, 2	2004-11-09
Interposer for electrically coupling a semiconductive device to an electrical apparatus Grant 6,777,965 - Mess August 17, 2	2004-08-17
Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board Grant 6,764,549 - Gochnour , et al. July 20, 2	2004-07-20
Heat sink with alignment and retaining features Grant 6,760,224 - Moden , et al. July 6, 2	2004-07-06
Stackable ceramic FBGA for high thermal applications App 20040104408 - Moden, Walter L. ; et al.	2004-06-03
Method of testing a semiconductor device Grant 6,690,188 - Mess February 10, 2	2004-02-10
Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board App 20040011283 - Gochnour, Derek J. ; et al.	2004-01-22
Stackable ceramic fbga for high thermal applications Grant 6,650,007 - Moden , et al. November 18, 2	2003-11-18
Alignment and orientation features for a semiconductor package App 20030205795 - Roberts, Stuart L. ; et al.	2003-11-06
Module assembly for stacked BGA packages App 20030197271 - Corisis, David J. ; et al.	2003-10-23
Stacked mass storage flash memory package App 20030137042 - Mess, Leonard E. ; et al.	2003-07-24
Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board Grant 6,592,670 - Gochnour , et al. July 15, 2	2003-07-15
Heat sink with alignment and retaining features App 20030128523 - Moden, Walter L. ; et al.	2003-07-10
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board App 20030111766 - Gochnour, Derek J. ; et al.	2003-06-19
Alignment and orientation features for a semiconductor package Grant 6,577,019 - Roberts , et al. June 10, 2	2003-06-10
Apparatus and methods of packaging and testing die Grant 6,558,966 - Mess , et al. May 6, 2	2003-05-06
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board Grant 6,527,999 - Gochnour , et al. March 4, 2	2003-03-04
Heat sink with alignment and retaining features Grant 6,525,943 - Moden , et al. February 25, 2	2003-02-25
Apparatus and methods of packaging and testing die Grant 6,512,302 - Mess , et al. January 28, 2	2003-01-28
Ball grid array (BGA) encapsulation mold App 20030003631 - Mess, Leonard E.	2003-01-02
Stacked mass storage flash memory package App 20020195697 - Mess, Leonard E. ; et al.	2002-12-26
Methods for ball grid array (BGA) encapsulation mold Grant 6,472,252 - Mess October 29, 2	2002-10-29
Module assembly for stacked BGA packages App 20020125571 - Corisis, David J. ; et al.	2002-09-12
Module assembly for stacked BGA packages with a common bus bar in the assembly Grant 6,414,391 - Corisis , et al. July 2, 2	2002-07-02
Apparatus and methods of packaging and testing die Grant 6,380,631 - Mess , et al. April 30, 2	2002-04-30
Apparatus and methods of packaging and testing die App 20020043658 - Mess, Leonard E. ; et al.	2002-04-18
Heat sink with alignment and retaining features App 20020024798 - Moden, Walter L. ; et al.	2002-02-28
Stackable ceramic fbga for high thermal applications App 20010048152 - Moden, Walter L. ; et al.	2001-12-06
Ball grid array (BGA) encapsulation mold App 20010044171 - Mess, Leonard E.	2001-11-22
Apparatus and methods of packaging and testing die App 20010040279 - Mess, Leonard E. ; et al.	2001-11-15
System for testing a semiconductor device App 20010035764 - Mess, Leonard E.	2001-11-01
Method of testing a semiconductive device App 20010035763 - Mess, Leonard E.	2001-11-01
Apparatus and methods of packaging and testing die App 20010026013 - Mess, Leonard E. ; et al.	2001-10-04
Stackable ceramic FBGA for high thermal applications Grant 6,297,548 - Moden , et al. October 2, 2	2001-10-02
Heat sink with alignment and retaining features Grant 6,297,960 - Moden , et al. October 2, 2	2001-10-02
Apparatus and methods of packaging and testing die Grant 6,294,839 - Mess , et al. September 25, 2	2001-09-25
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board App 20010012540 - Gochnour, Derek J. ; et al.	2001-08-09
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board Grant 6,224,936 - Gochnour , et al. May 1, 2	2001-05-01
Ball grid array (BGA) encapsulation mold Grant 6,164,946 - Mess December 26, 2	2000-12-26
Ball grid array (BGA) encapsulation mold Grant 6,007,317 - Mess December 28, 1	1999-12-28
Ball grid array (BGA) encapsulation mold Grant 5,923,959 - Mess July 13, 1	1999-07-13