| Patent | Date |
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Feedforward temperature control for plasma processing apparatus
Grant 10,854,425 - Mahadeswaraswamy , et al. December 1, 2 | 2020-12-01 |
Feedforward Temperature Control For Plasma Processing Apparatus
App 20160155612 - MAHADESWARASWAMY; Chetan ; et al. | 2016-06-02 |
Feedforward temperature control for plasma processing apparatus
Grant 9,338,871 - Mahadeswaraswamy , et al. May 10, 2 | 2016-05-10 |
Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
Grant 9,214,315 - Silveira , et al. December 15, 2 | 2015-12-15 |
Temperature Control In Plasma Processing Apparatus Using Pulsed Heat Transfer Fluid Flow
App 20150316941 - SILVEIRA; Fernando M. ; et al. | 2015-11-05 |
Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
Grant 8,916,793 - Silveira , et al. December 23, 2 | 2014-12-23 |
Automated Algorithm For Tuning Of Feedforward Control Parameters In Plasma Processing System
App 20140224767 - MERRY; Walter R. ; et al. | 2014-08-14 |
Temperature control with stacked proportioning valve
Grant 8,632,689 - Merry January 21, 2 | 2014-01-21 |
Temperature Control With Stacked Proportioning Valve
App 20130105442 - MERRY; Walter R. | 2013-05-02 |
Method and apparatus for removing polymer from the wafer backside and edge
Grant 8,329,593 - Yousif , et al. December 11, 2 | 2012-12-11 |
Efficient and accurate method for real-time prediction of the self-bias voltage of a wafer and feedback control of ESC voltage in plasma processing chamber
Grant 8,313,664 - Chen , et al. November 20, 2 | 2012-11-20 |
Temperature Control In Plasma Processing Apparatus Using Pulsed Heat Transfer Fluid Flow
App 20120132397 - Silveira; Fernando M. ; et al. | 2012-05-31 |
Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator
Grant 8,080,479 - Collins , et al. December 20, 2 | 2011-12-20 |
Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes
Grant 8,076,247 - Collins , et al. December 13, 2 | 2011-12-13 |
Feedforward Temperature Control For Plasma Processing Apparatus
App 20110186545 - MAHADESWARASWAMY; Chetan ; et al. | 2011-08-04 |
Process for wafer backside polymer removal and wafer front side photoresist removal
Grant 7,967,996 - Collins , et al. June 28, 2 | 2011-06-28 |
Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity
Grant 7,968,469 - Collins , et al. June 28, 2 | 2011-06-28 |
Apparatus And Method For Front Side Protection During Backside Cleaning
App 20110120505 - YOUSIF; IMAD ; et al. | 2011-05-26 |
Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources
Grant 7,884,025 - Collins , et al. February 8, 2 | 2011-02-08 |
Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources
Grant 7,879,731 - Collins , et al. February 1, 2 | 2011-02-01 |
Apparatus and method for front side protection during backside cleaning
Grant 7,879,183 - Yousif , et al. February 1, 2 | 2011-02-01 |
Efficient And Accurate Method For Real-time Prediction Of The Self-bias Voltage Of A Wafer And Feedback Control Of Esc Voltage In Plasma Processing Chamber
App 20100136793 - Chen; Zhigang ; et al. | 2010-06-03 |
Method Of Substrate Polymer Removal
App 20090293907 - Fung; Nancy ; et al. | 2009-12-03 |
Apparatus And Method For Front Side Protection During Backside Cleaning
App 20090214798 - YOUSIF; IMAD ; et al. | 2009-08-27 |
Matching network characterization using variable impedance analysis
Grant 7,554,334 - Shannon , et al. June 30, 2 | 2009-06-30 |
Method and apparatus for removing polymer from the wafer backside and edge
App 20090156013 - Yousif; Imad ; et al. | 2009-06-18 |
Plasma Reactor With Wide Process Window Employing Plural Vhf Sources
App 20080179011 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Process for wafer backside polymer removal and wafer front side photoresist removal
App 20080179291 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Method Of Processing A Workpiece In A Plasma Reactor With Variable Height Ground Return Path To Control Plasma Ion Density Uniformity
App 20080179181 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Controlling Rf Phase Between Opposing Electrodes
App 20080180028 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Reactor With Ion Distribution Uniformity Controller Employing Plural Vhf Sources
App 20080178803 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Apportioning Ground Return Path Impedances Among Plural Vhf Sources
App 20080182417 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Controlling A Variable Frequency Coupled To A Harmonic Resonator
App 20080182418 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Apportioning Power Among Plural Vhf Sources
App 20080182416 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Matching Network Characterization Using Variable Impedance Analysis
App 20080087381 - SHANNON; STEVEN C. ; et al. | 2008-04-17 |
Method and apparatus for in-situ film stack processing
Grant 7,358,192 - Merry , et al. April 15, 2 | 2008-04-15 |
Method for plasma etching a dielectric layer
Grant 7,056,830 - Merry , et al. June 6, 2 | 2006-06-06 |
Method and apparatus for in-situ film stack processing
App 20050224181 - Merry, Walter R. ; et al. | 2005-10-13 |
Method for plasma etching a dielectric layer
App 20050048789 - Merry, Walter R. ; et al. | 2005-03-03 |
Oxide Plasma Etching Process With A Controlled Wineglass Shape
App 20010003678 - STINNETT, JAMES A. ; et al. | 2001-06-14 |
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