Mermin; Daniel
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mermin; Daniel.The latest application filed is for "method for producing a solder bump on a substrate surface".
- Mermin; Daniel - Grenoble FR
- MERMIN; Daniel - Grenoble Cedex 09 FR
- Mermin; Daniel - Sassenage FR
| Patent | Date |
|---|---|
| Method for producing a solder bump on a substrate surface Grant 11,309,269 - Garnier , et al. April 19, 2 | 2022-04-19 |
| Method For Producing A Solder Bump On A Substrate Surface App 20210074659 - GARNIER; Arnaud ; et al. | 2021-03-11 |
| Storage for electric cable Grant 10,673,221 - Gaillard , et al. | 2020-06-02 |
| Electric cable and winding device for such a cable Grant 10,207,589 - Guillermin , et al. Feb | 2019-02-19 |
| Storage For Electric Cable App 20180083432 - GAILLARD; Frederic ; et al. | 2018-03-22 |
| Electric Cable And Winding Device For Such A Cable App 20170151879 - GUILLERMIN; Olivier ; et al. | 2017-06-01 |
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