Merilo; Dioscoro A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Merilo; Dioscoro A..The latest application filed is for "semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die".

Company Profile

0.81.60

Merilo; Dioscoro A. - Singapore N/A SG
Merilo; Dioscoro A. - Talisay PH
Merilo; Dioscoro A. - Talisay City PH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP Grant 9,922,955 - Camacho , et al. March 20, 2	2018-03-20
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die Grant 9,666,540 - Dahilig , et al. May 30, 2	2017-05-30
Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection Grant 9,589,876 - Camacho , et al. March 7, 2	2017-03-07
Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die Grant 9,589,910 - Pagaila , et al. March 7, 2	2017-03-07
Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die Grant 9,406,619 - Pagaila , et al. August 2, 2	2016-08-02
Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Grant 9,337,161 - Camacho , et al. May 10, 2	2016-05-10
Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die App 20160104681 - Dahilig; Frederick R. ; et al.	2016-04-14
RDL patterning with package on package system Grant 9,293,385 - Pagaila , et al. March 22, 2	2016-03-22
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die Grant 9,257,357 - Dahilig , et al. February 9, 2	2016-02-09
Semiconductor device and method of forming wafer level die integration Grant 9,142,514 - Camacho , et al. September 22, 2	2015-09-22
Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP Grant 9,064,876 - Pagaila , et al. June 23, 2	2015-06-23
Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die Grant 8,993,376 - Camacho , et al. March 31, 2	2015-03-31
Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers Grant 8,890,328 - Camacho , et al. November 18, 2	2014-11-18
Integrated Circuit Package System with Removable Backing Element Having Plated Terminal Leads and Method of Manufacture Thereof App 20140332955 - Camacho; Zigmund R. ; et al.	2014-11-13
Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect Grant 8,866,275 - Camacho , et al. October 21, 2	2014-10-21
Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Grant 8,810,017 - Camacho , et al. August 19, 2	2014-08-19
Integrated circuit packaging system with pad connection and method of manufacture thereof Grant 8,723,324 - Camacho , et al. May 13, 2	2014-05-13
System and apparatus for wafer level integration of components Grant 8,722,457 - Camacho , et al. May 13, 2	2014-05-13
Integrated circuit packaging system with interlock and method of manufacture thereof Grant 8,617,933 - Camacho , et al. December 31, 2	2013-12-31
Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection App 20130341789 - Camacho; Zigmund R. ; et al.	2013-12-26
Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die App 20130256866 - Dahilig; Frederick R. ; et al.	2013-10-03
Embedded integrated circuit package-on-package system Grant 8,546,929 - Ong , et al. October 1, 2	2013-10-01
Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection Grant 8,546,189 - Camacho , et al. October 1, 2	2013-10-01
Mountable integrated circuit package system with mountable integrated circuit die Grant 8,536,692 - Kuan , et al. September 17, 2	2013-09-17
Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die Grant 8,525,344 - Pagaila , et al. September 3, 2	2013-09-03
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die Grant 8,518,749 - Dahilig , et al. August 27, 2	2013-08-27
Semiconductor Device and Method of Forming Base Leads from Base Substrate as Standoff for Stacking Semiconductor Die App 20130214398 - Pagaila; Reza A. ; et al.	2013-08-22
Integrated circuit leaded stacked package system Grant 8,513,542 - Kuan , et al. August 20, 2	2013-08-20
Wirebondless wafer level package with plated bumps and interconnects Grant 8,502,376 - Camacho , et al. August 6, 2	2013-08-06
Semiconductor Device and Method of Forming Leadframe Interposer Over Semiconductor Die and TSV Substrate for Vertical Electrical Interconnect App 20130154076 - Camacho; Zigmund R. ; et al.	2013-06-20
Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die Grant 8,435,835 - Pagaila , et al. May 7, 2	2013-05-07
Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect Grant 8,409,922 - Camacho , et al. April 2, 2	2013-04-02
Integrated circuit packaging system with multiple row leads and method of manufacture thereof Grant 8,377,750 - Camacho , et al. February 19, 2	2013-02-19
Integrated Circuit Packaging System With Interlock And Method Of Manufacture Thereof App 20120299196 - Camacho; Zigmund Ramirez ; et al.	2012-11-29
Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP App 20120292785 - Pagaila; Reza A. ; et al.	2012-11-22
Integrated circuit packaging system with shielded package and method of manufacture thereof Grant 8,304,286 - Pagaila , et al. November 6, 2	2012-11-06
Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead Package App 20120273927 - Camacho; Zigmund R. ; et al.	2012-11-01
Wafer Level Die Integration and Method App 20120276691 - Camacho; Zigmund R. ; et al.	2012-11-01
Integrated Circuit Package System With Removable Backing Element Having Plated Terminal Leads And Method Of Manufacture Thereof App 20120261808 - Camacho; Zigmund Ramirez ; et al.	2012-10-18
Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP Grant 8,263,434 - Pagaila , et al. September 11, 2	2012-09-11
Semiconductor Device and Method of Forming Bond Wires Between Semiconductor Die Contact Pads and Conductive TOV in Peripheral Area Around Semiconductor Die App 20120217643 - Pagaila; Reza A. ; et al.	2012-08-30
Semiconductor device and method of forming wafer level multi-row etched lead package Grant 8,241,956 - Camacho , et al. August 14, 2	2012-08-14
Wafer level die integration and method Grant 8,241,954 - Camacho , et al. August 14, 2	2012-08-14
Stackable integrated circuit package system with multiple interconnect interface Grant 8,232,658 - Chow , et al. July 31, 2	2012-07-31
Method for manufacturing semiconductor package system with die support pad Grant 8,216,883 - Camacho , et al. July 10, 2	2012-07-10
Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Grant 8,212,342 - Camacho , et al. July 3, 2	2012-07-03
Integrated Circuit Packaging System With Multiple Row Leads And Method Of Manufacture Thereof App 20120146203 - Camacho; Zigmund Ramirez ; et al.	2012-06-14
Integrated Circuit Packaging System With Pad Connection And Method Of Manufacture Thereof App 20120139104 - Camacho; Zigmund Ramirez ; et al.	2012-06-07
Integrated Circuit Packaging System With Pad Connection And Method Of Manufacture Thereof App 20120139121 - Bathan; Henry Descalzo ; et al.	2012-06-07
Integrated circuit packaging system with pad connection and method of manufacture thereof Grant 8,193,037 - Bathan , et al. June 5, 2	2012-06-05
Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof Grant 8,178,394 - Merilo , et al. May 15, 2	2012-05-15
Semiconductor Device and Method of Mounting Pre-Fabricated Shielding Frame over Semiconductor Die App 20120112328 - Pagaila; Reza A. ; et al.	2012-05-10
Integrated circuit package system employing device stacking Grant 8,174,127 - Dahilig , et al. May 8, 2	2012-05-08
Integrated circuit package in package system Grant 8,164,172 - Ho , et al. April 24, 2	2012-04-24
Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Non-Linear Portions of Conductive Layers App 20120074567 - Camacho; Zigmund R. ; et al.	2012-03-29
Semiconductor Device and Method of Forming Leadframe Interposer Over Semiconductor Die and TSV Substrate for Vertical Electrical Interconnect App 20120061814 - Camacho; Zigmund R. ; et al.	2012-03-15
Semiconductor Device and Method of Forming Base Leads from Base Substrate as Standoff for Stacking Semiconductor Die App 20120056314 - Pagaila; Reza A. ; et al.	2012-03-08
Integrated circuit package system employing device stacking and method of manufacture thereof Grant 8,120,187 - Dahilig , et al. February 21, 2	2012-02-21
Semiconductor Device and Method of Forming Wafer-Level Multi-Row Etched Leadframe With Base Leads and Embedded Semiconductor Die App 20120038064 - Camacho; Zigmund R. ; et al.	2012-02-16
Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers Grant 8,105,915 - Camacho , et al. January 31, 2	2012-01-31
Stackable integrated circuit package system Grant 8,106,500 - Chow , et al. January 31, 2	2012-01-31
Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die Grant 8,097,489 - Pagaila , et al. January 17, 2	2012-01-17
Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die Grant 8,076,184 - Camacho , et al. December 13, 2	2011-12-13
Embedded integrated circuit package system and method of manufacture thereof Grant 8,067,832 - Ong , et al. November 29, 2	2011-11-29
Integrated Circuit Package In Package System App 20110248411 - Ho; Tsz Yin ; et al.	2011-10-13
Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead Package App 20110215449 - Camacho; Zigmund R. ; et al.	2011-09-08
Semiconductor Device and Method of Forming Package-on-Package Structure Electrically Interconnected Through TSV in WLCSP App 20110215458 - Camacho; Zigmund R. ; et al.	2011-09-08
Wirebondless Wafer Level Package with Plated Bumps and Interconnects App 20110204512 - Camacho; Zigmund R. ; et al.	2011-08-25
Integrated circuit package on package system Grant 7,986,043 - Merilo , et al. July 26, 2	2011-07-26
Integrated circuit package system with interconnect lock Grant 7,985,628 - Kuan , et al. July 26, 2	2011-07-26
Integrated circuit package in package system Grant 7,981,702 - Ho , et al. July 19, 2	2011-07-19
Integrated Circuit Package System Employing Device Stacking App 20110147899 - Dahilig; Frederick Rodriguez ; et al.	2011-06-23
Wirebondless wafer level package with plated bumps and interconnects Grant 7,964,450 - Camacho , et al. June 21, 2	2011-06-21
Integrated Circuit Package System With Removable Backing Element Having Plated Terminal Leads And Method Of Manufacture Thereof App 20110140251 - Camacho; Zigmund Ramirez ; et al.	2011-06-16
Integrated Circuit Packaging System With Shielded Package And Method Of Manufacture Thereof App 20110140247 - Pagaila; Reza Argenty ; et al.	2011-06-16
Method For Manufacturing Semiconductor Package System With Die Support Pad App 20110129965 - Camacho; Zigmund Ramirez ; et al.	2011-06-02
Embedded Integrated Circuit Package System And Method Of Manufacture Thereof App 20110079899 - Ong; You Yang ; et al.	2011-04-07
Semiconductor package system with die support pad Grant 7,911,067 - Camacho , et al. March 22, 2	2011-03-22
Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP App 20110024888 - Pagaila; Reza A. ; et al.	2011-02-03
Integrated Circuit Package System Employing Device Stacking And Method Of Manufacture Thereof App 20110012270 - Dahilig; Frederick Rodriguez ; et al.	2011-01-20
Integrated circuit package-on-package stacking system Grant 7,868,434 - Merilo , et al. January 11, 2	2011-01-11
Embedded integrated circuit package system Grant 7,859,098 - Ong , et al. December 28, 2	2010-12-28
Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die App 20100320588 - Dahilig; Frederick R. ; et al.	2010-12-23
Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Non-Linear Portions of Conductive Layers App 20100314780 - Camacho; Zigmund R. ; et al.	2010-12-16
Integrated circuit package system employing device stacking Grant 7,830,020 - Dahilig , et al. November 9, 2	2010-11-09
Quad Flat Pack In Quad Flat Pack Integrated Circuit Package System And Method For Manufacturing Thereof App 20100264528 - Merilo; Dioscoro A. ; et al.	2010-10-21
Semiconductor Device and Method of Mounting Pre-Fabricated Shielding Frame over Semiconductor Die App 20100237477 - Pagaila; Reza A. ; et al.	2010-09-23
Stackable Integrated Circuit Package System App 20100219523 - Chow; Seng Guan ; et al.	2010-09-02
Quad flat pack in quad flat pack integrated circuit package system Grant 7,777,320 - Merilo , et al. August 17, 2	2010-08-17
Integrated Circuit Package-on-package Stacking System App 20100176497 - Merilo; Dioscoro A. ; et al.	2010-07-15
Stackable integrated circuit package system Grant 7,741,707 - Chow , et al. June 22, 2	2010-06-22
Integrated circuit package-on-package stacking system and method of manufacture thereof Grant 7,718,472 - Merilo , et al. May 18, 2	2010-05-18
Integrated circuit package system with package integration Grant 7,709,944 - Kuan , et al. May 4, 2	2010-05-04
Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection App 20100072599 - Camacho; Zigmund R. ; et al.	2010-03-25
Semiconductor Package System With Die Support Pad App 20100072589 - Camacho; Zigmund Ramirez ; et al.	2010-03-25
Quad Flat Pack In Quad Flat Pack Integrated Circuit Package System App 20100072586 - Merilo; Dioscoro A. ; et al.	2010-03-25
Rdl Patterning With Package On Package System App 20100025833 - Pagaila; Reza Argenty ; et al.	2010-02-04
Wirebondless Wafer Level Package with Plated Bumps and Interconnects App 20090289356 - Camacho; Zigmund R. ; et al.	2009-11-26
Integrated Circuit Package-on-package Stacking System App 20090179312 - Merilo; Dioscoro A. ; et al.	2009-07-16
System and Apparatus for Wafer Level Integration of Components App 20090166825 - Camacho; Zigmund R. ; et al.	2009-07-02
Integrated Circuit Package System With Interconnect Lock App 20090152706 - Kuan; Heap Hoe ; et al.	2009-06-18
Integrated Circuit Package System With Package Integration App 20090152701 - Kuan; Heap Hoe ; et al.	2009-06-18
Mountable Integrated Circuit Package System With Mountable Integrated Circuit Die App 20090152700 - Kuan; Heap Hoe ; et al.	2009-06-18
Wafer Level Die Integration and Method App 20090140441 - Camacho; Zigmund R. ; et al.	2009-06-04
Integrated circuit package-on-package stacking system Grant 7,535,086 - Merilo , et al. May 19, 2	2009-05-19
Integrated Circuit Package System Employing Device Stacking App 20080315411 - Dahilig; Frederick Rodriguez ; et al.	2008-12-25
Stackable Integrated Circuit Package System With Multiple Interconnect Interface App 20080203549 - Chow; Seng Guan ; et al.	2008-08-28
Stackable integrated circuit package system with multiple interconnect interface Grant 7,385,299 - Chow , et al. June 10, 2	2008-06-10
Integrated Circuit Package-on-package Stacking System App 20080029858 - Merilo; Dioscoro A. ; et al.	2008-02-07
Embedded Integrated Circuit Package System App 20070246806 - Ong; You Yang ; et al.	2007-10-25
Embedded Integrated Circuit Package-on-package System App 20070246813 - Ong; You Yang ; et al.	2007-10-25
Integrated Circuit Leaded Stacked Package System App 20070209834 - Kuan; Heap Hoe ; et al.	2007-09-13
Integrated Circuit Package In Package System App 20070210424 - Ho; Tsz Yin ; et al.	2007-09-13
Integrated Circuit Package On Package System App 20070210443 - Merilo; Dioscoro A. ; et al.	2007-09-13
Stackable Integrated Circuit Package System With Multiple Interconnect Interface App 20070200257 - Chow; Seng Guan ; et al.	2007-08-30
Stackable Integrated Circuit Package System App 20070200230 - Chow; Seng Guan ; et al.	2007-08-30
Super thin/super thermal ball grid array package Grant 6,744,125 - Camenforte , et al. June 1, 2	2004-06-01
Super thin/super thermal ball grid array package App 20030143777 - Camenforte, Raymundo M. ; et al.	2003-07-31
Super thin/super thermal ball grid array package Grant 6,537,848 - Camenforte , et al. March 25, 2	2003-03-25
Super thin/super thermal ball grid array package App 20020180040 - Camenforte, Raymundo M. ; et al.	2002-12-05