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Meng; Hsien-Kai Patent Filings

Meng; Hsien-Kai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Meng; Hsien-Kai.The latest application filed is for "wiring structure for use in micro piezoelectric pump".

Company Profile
0.2.5
  • Meng; Hsien-Kai - Taoyuan Hsien TW
  • MENG; Hsien Kai - Taipei City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wiring structure for use in micro piezoelectric pump
Grant 8,162,628 - Meng , et al. April 24, 2
2012-04-24
Wiring Structure For Use In Micro Piezoelectric Pump
App 20100068080 - Meng; Hsien-Kai ;   et al.
2010-03-18
Piezoelectric micro-pump and driving circuit thereof
Grant 7,679,262 - Meng , et al. March 16, 2
2010-03-16
Beauty/medication patch
App 20100008960 - MENG; Hsien Kai ;   et al.
2010-01-14
Value Structure
App 20090092503 - Meng; Hsien-Kai ;   et al.
2009-04-09
Piezoelectric Micro-pump And Driving Circuit Thereof
App 20090015097 - Meng; Hsien Kai ;   et al.
2009-01-15
Beauty/medication patch
App 20080268007 - Meng; Hsien Kai ;   et al.
2008-10-30

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