Meng; Ching Ling

Patent Applications and Registrations

Patent applications and USPTO patent grants for Meng; Ching Ling.The latest application filed is for "optical sensor for inspecting pattern collapse defects".

Company Profile

7.29.31

Meng; Ching Ling - Fremont CA
MENG; Ching-Ling - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for monitoring and measuring properties of polymers in solutions Grant 11,385,154 - Maleev , et al. July 12, 2	2022-07-12
Optical Sensor for Inspecting Pattern Collapse Defects App 20220139743 - MALEEV; Ivan ; et al.	2022-05-05
Apparatus And Method For Monitoring And Measuring Properties Of Polymers In Solutions App 20220099545 - MALEEV; Ivan ; et al.	2022-03-31
Normal-incidence In-situ Process Monitor Sensor App 20210193444 - MENG; Ching Ling ; et al.	2021-06-24
Normal-incident in-situ process monitor sensor Grant 10,978,278 - Meng , et al. April 13, 2	2021-04-13
Optical sensor for phase determination Grant 10,837,902 - Maleev , et al. November 17, 2	2020-11-17
Advanced optical sensor and method for detecting an optical event in a light emission signal in a plasma chamber Grant 10,692,705 - Mihaylov , et al.	2020-06-23
Normal-incident In-situ Process Monitor Sensor App 20200043710 - Meng; Ching Ling ; et al.	2020-02-06
Spatially resolved optical emission spectroscopy (OES) in plasma processing Grant 10,473,525 - Meng , et al. Nov	2019-11-12
Dark field wafer nano-defect inspection system with a singular beam Grant 10,345,246 - Tian , et al. July 9, 2	2019-07-09
Optical Sensor For Phase Determination App 20190056320 - MALEEV; Ivan ; et al.	2019-02-21
Advanced Optical Sensor, System, And Methodologies For Etch Processing Monitoring App 20180286643 - TUITJE; Holger ; et al.	2018-10-04
Spatially resolved optical emission spectroscopy (OES) in plasma processing Grant 9,970,818 - Bao , et al. May 15, 2	2018-05-15
Differential acoustic time of flight measurement of temperature of semiconductor substrates Grant 9,846,088 - Pei , et al. December 19, 2	2017-12-19
Dark Field Wafer Nano-defect Inspection System With A Singular Beam App 20170350826 - TIAN; Xinkang ; et al.	2017-12-07
Spatially Resolved Optical Emission Spectroscopy (oes) In Plasma Processing App 20170314991 - MENG; Ching-Ling ; et al.	2017-11-02
Advanced Optical Sensor And Method For Plasma Chamber App 20170140905 - Mihaylov; Mihail ; et al.	2017-05-18
System for in-situ film stack measurement during etching and etch control method Grant 9,059,038 - Li , et al. June 16, 2	2015-06-16
Spatially Resolved Optical Emission Spectroscopy (oes) In Plasma Processing App 20150124250 - BAO; Junwei ; et al.	2015-05-07
Differential Acoustic Time Of Flight Measurement Of Temperature Of Semiconductor Substrates App 20150078416 - PEI; Jun ; et al.	2015-03-19
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Grant 8,831,767 - Lehman , et al. September 9, 2	2014-09-09
System For In-situ Film Stack Measurement During Etching And Etch Control Method App 20140024143 - LI; Shifang ; et al.	2014-01-23
Methods And Systems For Monitoring A Parameter Of A Measurement Device During Polishing, Damage To A Specimen During Polishing, Or A Characteristic Of A Polishing Pad Or Tool App 20110313558 - Lehman; Kurt ; et al.	2011-12-22
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Grant 8,010,222 - Lehman , et al. August 30, 2	2011-08-30
Method and system for lamp temperature control in optical metrology Grant 7,789,541 - Meng , et al. September 7, 2	2010-09-07
Automated process control using an optical metrology system optimized with design goals Grant 7,761,178 - Tian , et al. July 20, 2	2010-07-20
Optical metrology system optimized with design goals Grant 7,761,250 - Tian , et al. July 20, 2	2010-07-20
Designing an optical metrology system optimized with signal criteria Grant 7,742,889 - Tian , et al. June 22, 2	2010-06-22
Apparatus for designing an optical metrology system optimized with signal criteria Grant 7,734,437 - Tian , et al. June 8, 2	2010-06-08
Automated Process Control Using An Optical Metrology System Optimized With Design Goals App 20090319075 - TIAN; XINKANG ; et al.	2009-12-24
Optical Metrology System Optimized With Design Goals App 20090319214 - TIAN; XINKANG ; et al.	2009-12-24
Process Control Using An Optical Metrology System Optimized With Signal Criteria App 20090248341 - TIAN; XINKANG ; et al.	2009-10-01
Method And System For Lamp Temperature Control In Optical Metrology App 20090244910 - MENG; Ching-Ling ; et al.	2009-10-01
Designing An Optical Metrology System Optimized With Signal Criteria App 20090248339 - TIAN; XINKANG ; et al.	2009-10-01
Apparatus For Designing An Optical Metrology System Optimized With Signal Criteria App 20090248340 - TIAN; XINKANG ; et al.	2009-10-01
Optical metrology system optimized with a plurality of design goals Grant 7,595,869 - Tian , et al. September 29, 2	2009-09-29
Apparatus For Designing An Optical Metrology System Optimized For Operating Time Budget App 20090240537 - TIAN; XINKANG ; et al.	2009-09-24
Method Of Designing An Optical Metrology System Optimized For Operating Time Budget App 20090234687 - TIAN; XINKANG ; et al.	2009-09-17
Process control using an optical metrology system optimized with signal criteria Grant 7,589,845 - Tian , et al. September 15, 2	2009-09-15
Gas purge system and methods Grant 7,420,681 - Wang , et al. September 2, 2	2008-09-02
Methods And Systems For Monitoring A Parameter Of A Measurement Device During Polishing, Damage To A Specimen During Polishing, Or A Characteristic Of A Polishing Pad Or Tool App 20080207089 - Lehman; Kurt ; et al.	2008-08-28
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Grant 7,332,438 - Lehman , et al. February 19, 2	2008-02-19
Optical device latching mechanism Grant 7,281,862 - Oen , et al. October 16, 2	2007-10-16
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device Grant 7,175,503 - Lehman , et al. February 13, 2	2007-02-13
Optical device latching mechanism App 20060222301 - Oen; Joshua T. ; et al.	2006-10-05
Methods and systems for detecting a presence of blobs on a specimen during a polishing process App 20060148383 - Lehman; Kurt ; et al.	2006-07-06
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool App 20060131273 - Lehman; Kurt ; et al.	2006-06-22
Methods and systems for detecting a presence of blobs on a specimen during a polishing process Grant 7,052,369 - Lehman , et al. May 30, 2	2006-05-30
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Grant 7,030,018 - Lehman , et al. April 18, 2	2006-04-18
Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing Grant 6,935,922 - Lehman , et al. August 30, 2	2005-08-30
Systems and methods for characterizing a polishing process Grant 6,884,146 - Lehman , et al. April 26, 2	2005-04-26
Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad Grant 6,866,559 - Lehman , et al. March 15, 2	2005-03-15
Chemical mechanical planarization system Grant 6,679,755 - Sommer , et al. January 20, 2	2004-01-20
Methods and systems for detecting a presence of blobs on a specimen during a polishing process App 20030190864 - Lehman, Kurt ; et al.	2003-10-09
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool App 20030180973 - Lehman, Kurt ; et al.	2003-09-25
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device App 20030181138 - Lehman, Kurt ; et al.	2003-09-25
Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad App 20030181139 - Lehman, Kurt ; et al.	2003-09-25
Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing App 20030181132 - Lehman, Kurt ; et al.	2003-09-25
Systems and methods for characterizing a polishing process App 20030181131 - Lehman, Kurt ; et al.	2003-09-25

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