Melzl; Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Melzl; Michael.The latest application filed is for "electrolyte, method of forming a copper layer and method of forming a chip".

Company Profile

1.12.10

Melzl; Michael - Neutraubling DE
Melzl, Michael - Regensburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrolyte, method of forming a copper layer and method of forming a chip Grant 10,648,096 - Robl , et al.	2020-05-12
Electrolyte, Method Of Forming A Copper Layer And Method Of Forming A Chip App 20160168739 - ROBL; Werner ; et al.	2016-06-16
Treatment of a substrate with a liquid medium Grant 8,759,230 - Bradl , et al. June 24, 2	2014-06-24
Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element Grant 8,669,666 - Hammer , et al. March 11, 2	2014-03-11
Method for machining a workpiece on a workpiece support Grant 8,357,588 - Bradl , et al. January 22, 2	2013-01-22
Method For Machining A Workpiece On A Workpiece Support App 20110232074 - Bradl; Stephen ; et al.	2011-09-29
Method for machining a workpiece on a workpiece support Grant 7,892,947 - Bradl , et al. February 22, 2	2011-02-22
Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element App 20110031625 - Hammer; Markus ; et al.	2011-02-10
Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart Grant 7,851,913 - Gutt , et al. December 14, 2	2010-12-14
Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element Grant 7,829,450 - Hammer , et al. November 9, 2	2010-11-09
Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium Grant 7,566,378 - Bradl , et al. July 28, 2	2009-07-28
Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element App 20090115074 - Hammer; Markus ; et al.	2009-05-07
Treatment of a Substrate with a Liquid Medium App 20090093127 - Bradl; Stephan ; et al.	2009-04-09
Semiconductor device and method for producing a semiconductor device App 20080122091 - Gutt; Thomas ; et al.	2008-05-29
Method for machining a workpiece on a workpiece support App 20070117351 - Bradl; Stephan ; et al.	2007-05-24
Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium App 20060276010 - Bradl; Stephan ; et al.	2006-12-07
Electronic component and utilization of a guard structure contained therein Grant 6,714,392 - Opolka , et al. March 30, 2	2004-03-30
Electronic component and utilization of a guard structure contained therein App 20020066942 - Opolka, Heinz ; et al.	2002-06-06
Method for treatment of semiconductor substrates App 20010000160 - Schwaiger, Josef ; et al.	2001-04-05

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