Melville; Ian D. W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Melville; Ian D. W..The latest application filed is for "split probe pad structure and method".

Company Profile

2.5.6

Melville; Ian D. W. - Highland NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Split probe pad structure and method Grant 10,276,461 - Melville , et al.	2019-04-30
Split Probe Pad Structure And Method App 20190043769 - Melville; Ian D.W. ; et al.	2019-02-07
Ic Structure Including Tsv Having Metal Resistant To High Temperatures And Method Of Forming Same App 20180337089 - Farooq; Mukta G. ; et al.	2018-11-22
IC structure on two sides of substrate and method of forming Grant 10,068,899 - Melville , et al. September 4, 2	2018-09-04
IC structure including TSV having metal resistant to high temperatures and method of forming same Grant 10,049,979 - Farooq , et al. August 14, 2	2018-08-14
Ic Structure Including Tsv Having Metal Resistant To High Temperatures And Method Of Forming Same App 20180108607 - Farooq; Mukta G. ; et al.	2018-04-19
Ic Structure On Two Sides Of Substrate And Method Of Forming App 20180053743 - Melville; Ian D. W. ; et al.	2018-02-22
Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures Grant 8,076,756 - Lane , et al. December 13, 2	2011-12-13
Structure For Inhibiting Back End Of Line Damage From Dicing And Chip Packaging Interaction Failures App 20110140245 - LANE; MICHAEL W. ; et al.	2011-06-16
Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures Grant 7,955,955 - Lane , et al. June 7, 2	2011-06-07
Inhibiting Damage From Dicing And Chip Packaging Interaction Failures In Back End Of Line Structures App 20080277765 - Lane; Michael W. ; et al.	2008-11-13

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