Melville; Ian D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Melville; Ian D..The latest application filed is for "semiconductor wafer with nonstick seal region".

Company Profile

4.43.44

Melville; Ian D. - Highland NY US
- Highland NY US
Melville; Ian D - Hopewell Junction NY
Melville; Ian D - Highland NY
MELVILLE; IAN D. - HOPEWELL JUNCTION NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ionizing radiation blocking in IC chip to reduce soft errors Grant 10,784,200 - Farooq , et al. Sept	2020-09-22
Stress-resilient chip structure and dicing process Grant 10,211,175 - Indyk , et al. Feb	2019-02-19
Multi-project wafer with IP protection by reticle mask pattern modification Grant 9,947,645 - Tan , et al. April 17, 2	2018-04-17
Semiconductor Wafer With Nonstick Seal Region App 20150303102 - Arvin; Charles L. ; et al.	2015-10-22
Ip Protection App 20150294964 - TAN; Soon Yoeng ; et al.	2015-10-15
IP protection Grant 9,069,923 - Tan , et al. June 30, 2	2015-06-30
Structure and method for making crack stop for 3D integrated circuits Grant 9,059,167 - Farooq , et al. June 16, 2	2015-06-16
Ionizing radiation blocking in IC chip to reduce soft errors Grant 8,999,764 - Farooq , et al. April 7, 2	2015-04-07
Stress-resilient Chip Structure And Dicing Process App 20150001714 - Indyk; Richard F. ; et al.	2015-01-01
Semiconductor device having a copper plug Grant 8,922,019 - Farooq , et al. December 30, 2	2014-12-30
Semiconductor device having a copper plug Grant 08922019 -	2014-12-30
Structure And Method For Making Crack Stop For 3d Integrated Circuits App 20140339703 - Farooq; Mukta G. ; et al.	2014-11-20
Structure and method for making crack stop for 3D integrated circuits Grant 8,859,390 - Farooq , et al. October 14, 2	2014-10-14
Wafer backside defectivity clean-up utilizing selective removal of substrate material Grant 8,835,289 - Clark , et al. September 16, 2	2014-09-16
Passivation layer surface topography modifications for improved integrity in packaged assemblies Grant 8,786,059 - Blander , et al. July 22, 2	2014-07-22
Semiconductor device having a copper plug Grant 8,749,059 - Farooq , et al. June 10, 2	2014-06-10
Stress-resilient Chip Structure And Dicing Process App 20140151879 - Indyk; Richard F. ; et al.	2014-06-05
Semiconductor device having a copper plug Grant 8,741,769 - Farooq , et al. June 3, 2	2014-06-03
Structures and methods to reduce maximum current density in a solder ball Grant 8,674,506 - Bezama , et al. March 18, 2	2014-03-18
Semiconductor Device Having A Copper Plug App 20140054778 - Farooq; Mukta G. ; et al.	2014-02-27
Semiconductor device having a copper plug Grant 8,610,283 - Farooq , et al. December 17, 2	2013-12-17
Coaxial solder bump support structure Grant 8,563,416 - Erwin , et al. October 22, 2	2013-10-22
Wafer Backside Defectivity Clean-up Utilizing Selective Removal Of Substrate Material App 20130273743 - Clark; Jennifer C. ; et al.	2013-10-17
Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20130234329 - BEZAMA; Raschid J. ; et al.	2013-09-12
Wafer backside defectivity clean-up utilizing selective removal of substrate material Grant 8,486,814 - Clark , et al. July 16, 2	2013-07-16
Controlling Density Of Particles Within Underfill Surrounding Solder Bump Contacts App 20130161822 - Barbeau; Stephane S. ; et al.	2013-06-27
Semiconductor Device Having A Copper Plug App 20130157458 - Farooq; Mukta G. ; et al.	2013-06-20
Soft error rate mitigation by interconnect structure Grant 8,445,374 - Farooq , et al. May 21, 2	2013-05-21
Structures and methods to reduce maximum current density in a solder ball Grant 8,446,006 - Bezama , et al. May 21, 2	2013-05-21
Coaxial Solder Bump Support Structure App 20130026624 - Erwin; Brian Michael ; et al.	2013-01-31
Wafer Backside Defectivity Clean-up Utilizing Slective Removal Of Substrate Material App 20130020682 - Clark; Jennifer C. ; et al.	2013-01-24
Ip Protection App 20120319246 - TAN; Soon Yoeng ; et al.	2012-12-20
Passivation Layer Surface Topography Modifications For Improved Integrity In Packaged Assemblies App 20120228748 - BLANDER; ALEXANDRE ; et al.	2012-09-13
Passivation layer surface topography modifications for improved integrity in packaged assemblies Grant 8,236,615 - Blander , et al. August 7, 2	2012-08-07
Semiconductor Device Having A Copper Plug App 20120168952 - Farooq; Mukta G. ; et al.	2012-07-05
Controlling Density Of Particles Within Underfill Surrounding Solder Bump Contacts App 20120168956 - Barbeau; Stephane S. ; et al.	2012-07-05
Ionizing Radiation Blocking In Ic Chip To Reduce Soft Errors App 20120161300 - Farooq; Mukta G. ; et al.	2012-06-28
Soft Error Rate Mitigation By Interconnect Structure App 20120135564 - Farooq; Mukta G. ; et al.	2012-05-31
Soft error rate mitigation by interconnect structure Grant 8,120,175 - Farooq , et al. February 21, 2	2012-02-21
Underbump metallurgy for enhanced electromigration resistance Grant 8,022,543 - Farooq , et al. September 20, 2	2011-09-20
Structure And Method For Making Crack Stop For 3d Integrated Circuits App 20110193197 - FAROOQ; MUKTA G. ; et al.	2011-08-11
Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20110147922 - BEZAMA; Raschid J. ; et al.	2011-06-23
Passivation Layer Surface Topography Modifications For Improved Integrity In Packaged Assemblies App 20110121469 - Blander; Alexandre ; et al.	2011-05-26
Semiconductor Device Having A Copper Plug App 20110079907 - FAROOQ; MUKTA G. ; et al.	2011-04-07
Method and structure to reduce cracking in flip chip underfill Grant 7,919,356 - Farooq , et al. April 5, 2	2011-04-05
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners Grant 7,875,502 - Brofman , et al. January 25, 2	2011-01-25
Structure and method for enhancing resistance to fracture of bonding pads Grant 7,867,887 - Melville , et al. January 11, 2	2011-01-11
Solder connector structure and method Grant 7,816,248 - Farooq , et al. October 19, 2	2010-10-19
Semiconductor Chips With Crack Stop Regions For Reducing Crack Propagation From Chip Edges/corners App 20100233872 - Brofman; Peter J. ; et al.	2010-09-16
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners Grant 7,732,932 - Brofman , et al. June 8, 2	2010-06-08
Semiconductor Chip Shape Alteration App 20100019354 - Farooq; Mukta G. ; et al.	2010-01-28
Semiconductor chip shape alteration Grant 7,648,891 - Farooq , et al. January 19, 2	2010-01-19
Test structures for electrically detecting back end of the line failures and methods of making and using the same Grant 7,622,737 - Farooq , et al. November 24, 2	2009-11-24
Underbump Metallurgy For Enhanced Electromigration Resistance App 20090243098 - Farooq; Mukta G. ; et al.	2009-10-01
Structure and method for enhancing resistance to fracture of bonding pads Grant 7,573,115 - Melville , et al. August 11, 2	2009-08-11
Soft Error Rate Mitigation By Interconnect Structure App 20090140420 - Farooq; Mukta G. ; et al.	2009-06-04
Ionizing Radiation Blocking In Ic Chip To Reduce Soft Errors App 20090039515 - Farooq; Mukta G. ; et al.	2009-02-12
Method And Structure To Reduce Cracking In Flip Chip Underfill App 20090032974 - Farooq; Mukta G. ; et al.	2009-02-05
Semiconductor Chips With Crack Stop Regions For Reducing Crack Propagation From Chip Edges/corners App 20090032909 - Brofman; Peter J. ; et al.	2009-02-05
Test Structures For Electrically Detecting Back End Of The Line Failures And Methods Of Making And Using The Same App 20090015285 - Farooq; Mukta G. ; et al.	2009-01-15
Solder connector structure and method Grant 7,470,985 - Farooq , et al. December 30, 2	2008-12-30
Structure And Method For Enhancing Resistance To Fracture Of Bonding Pads App 20080274608 - Melville; Ian D. ; et al.	2008-11-06
Solder Connector Structure And Method App 20080248643 - Farooq; Mukta G. ; et al.	2008-10-09
Semiconductor Chip Shape Alteration App 20080150087 - Farooq; Mukta G. ; et al.	2008-06-26
Method and structure for eliminating aluminum terminal pad material in semiconductor devices Grant 7,375,021 - Edelstein , et al. May 20, 2	2008-05-20
Structure And Method For Enhancing Resistance To Fracture Of Bonding Pads App 20080111250 - Melville; Ian D. ; et al.	2008-05-15
Chip Location Identification App 20080057677 - Charles; Sylvie ; et al.	2008-03-06
Methods Of Forming Aluminum-free Wire Bond Pad And Pad So Formed App 20080038913 - Farooq; Mukta G. ; et al.	2008-02-14
Via Stack Structures App 20080029898 - Farooq; Mukta G. ; et al.	2008-02-07
Solder Connector Structure And Method App 20080023827 - Farooq; Mukta G. ; et al.	2008-01-31
Method And Structure For Eliminating Aluminum Terminal Pad Material In Semiconductor Devices App 20070232049 - Edelstein; Daniel C. ; et al.	2007-10-04
Ild Layer With Intermediate Dielectric Constant Material Immediately Below Silicon Dioxide Based Ild Layer App 20070187828 - Farooq; Mukta G. ; et al.	2007-08-16
Semiconductors And Methods Of Making App 20070080455 - Zupanski-Nielsen; Donna S. ; et al.	2007-04-12
Structure and method for reducing thermo-mechanical stress in stacked vias Grant 6,831,363 - Dalton , et al. December 14, 2	2004-12-14
Structure and method for reducing thermo-mechanical stress in stacked vias App 20040113278 - Dalton, Timothy J. ; et al.	2004-06-17