Melton; Cynthia M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Melton; Cynthia M..The latest application filed is for "low-profile microelectronic package".

Company Profile

0.14.0

Melton; Cynthia M. - Bolingbrook IL
Melton; Cynthia M. - Bollingbrook IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low-profile microelectronic package Grant 6,194,250 - Melton , et al. February 27, 2	2001-02-27
Microelectronic package including a polymer encapsulated die Grant 6,093,972 - Carney , et al. July 25, 2	2000-07-25
Microelectronic package including a polymer encapsulated die, and method for forming same Grant 5,895,229 - Carney , et al. April 20, 1	1999-04-20
Low-profile microelectronic package Grant 5,844,315 - Melton , et al. December 1, 1	1998-12-01
Method for forming a solder bump by solder-jetting or the like Grant 5,597,110 - Melton , et al. January 28, 1	1997-01-28
Immersion plating of tin-bismuth solder Grant 5,435,838 - Melton , et al. July 25, 1	1995-07-25
Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties Grant 5,429,292 - Melton , et al. July 4, 1	1995-07-04
Tin-zinc solder connection to a printed circuit board of the like Grant 5,390,080 - Melton , et al. February 14, 1	1995-02-14
Solder bump interconnection formed using spaced solder deposit and consumable path Grant 5,282,565 - Melton February 1, 1	1994-02-01
Low temperature method for forming solder bump interconnections to a plated circuit trace Grant 5,269,453 - Melton , et al. December 14, 1	1993-12-14
Low temperature-wetting tin-base solder paste Grant 5,229,070 - Melton , et al. July 20, 1	1993-07-20
Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature Grant 5,221,038 - Melton , et al. June 22, 1	1993-06-22
Noncollapsing multisolder interconnection Grant 5,154,341 - Melton , et al. October 13, 1	1992-10-13
Palladium-coated solder ball Grant 5,086,966 - Melton , et al. February 11, 1	1992-02-11

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