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Patent applications and USPTO patent grants for Melcher; Roger.The latest application filed is for "bumps bonds formed as metal line interconnects in a semiconductor device".
Patent | Date |
---|---|
Bumps bonds formed as metal line interconnects in a semiconductor device Grant 9,812,380 - Dix , et al. November 7, 2 | 2017-11-07 |
Bumps Bonds Formed As Metal Line Interconnects In A Semiconductor Device App 20160013121 - Dix; Greg ;   et al. | 2016-01-14 |
Multiple well drain engineering for HV MOS devices Grant 8,962,397 - Dix , et al. February 24, 2 | 2015-02-24 |
Power MOS transistor with improved metal contact Grant 8,937,351 - Dix , et al. January 20, 2 | 2015-01-20 |
Insulated bump bonding Grant 8,921,986 - Dix , et al. December 30, 2 | 2014-12-30 |
Insulated Bump Bonding App 20140264796 - Dix; Gregory ;   et al. | 2014-09-18 |
Power MOS Transistor with Improved Metal Contact App 20140246722 - Dix; Gregory ;   et al. | 2014-09-04 |
Multiple Well Drain Engineering For Hv Mos Devices App 20130026545 - Dix; Gregory ;   et al. | 2013-01-31 |
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