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name:-0.0071098804473877
name:-0.33728194236755
name:-0.0059521198272705
Melcher; DeAnn Eileen Patent Filings

Melcher; DeAnn Eileen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Melcher; DeAnn Eileen.The latest application filed is for "wafer level surface passivation of stackable integrated circuit chips".

Company Profile
0.9.4
  • Melcher; DeAnn Eileen - San Jose CA US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electrical connector between die pad and z-interconnect for stacked die assemblies
Grant 9,153,517 - Co , et al. October 6, 2
2015-10-06
Semiconductor die array structure
Grant 8,884,403 - Co , et al. November 11, 2
2014-11-11
Semiconductor die mount by conformal die coating
Grant 8,704,379 - Crane , et al. April 22, 2
2014-04-22
Wafer level surface passivation of stackable integrated circuit chips
Grant 8,324,081 - McElrea , et al. December 4, 2
2012-12-04
Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips
App 20110147943 - McElrea; Simon J. S. ;   et al.
2011-06-23
Semiconductor Die Separation Method
App 20110101505 - Co; Reynaldo ;   et al.
2011-05-05
Wafer level surface passivation of stackable integrated circuit chips
Grant 7,923,349 - McElrea , et al. April 12, 2
2011-04-12
Semiconductor die separation method
Grant 7,863,159 - Co , et al. January 4, 2
2011-01-04
Semiconductor Die Separation Method
App 20090315174 - Co; Reynaldo ;   et al.
2009-12-24
Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips
App 20080315434 - McElrea; Simon J.S. ;   et al.
2008-12-25

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