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Tunable passive semiconductor elements
Grant 11,437,366 - Zhang , et al. September 6, 2 | 2022-09-06 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20220231394 - ELSHERBINI; Adel A. ; et al. | 2022-07-21 |
Low loss and low cross talk transmission lines having l-shaped cross sections
Grant 11,329,358 - Elsherbini , et al. May 10, 2 | 2022-05-10 |
EMIB copper layer for signal and power routing
Grant 11,322,445 - Mekonnen , et al. May 3, 2 | 2022-05-03 |
Emib Copper Layer For Signal And Power Routing
App 20210296240 - Mekonnen; Yidnekachew S. ; et al. | 2021-09-23 |
Simplified multimode signaling techniques
Grant 10,992,342 - Mekonnen , et al. April 27, 2 | 2021-04-27 |
Package power delivery using plane and shaped vias
Grant 10,971,416 - Bharath , et al. April 6, 2 | 2021-04-06 |
Package Pin Pattern For Device-to-device Connection
App 20210074333 - ZHAO; Chong J. ; et al. | 2021-03-11 |
Rlink--die to die channel interconnect configurations to improve signaling
Grant 10,784,204 - Aygun , et al. Sept | 2020-09-22 |
MINIMIZATION OF INSERTION LOSS VARIATION IN THROUGH-SILICON VIAS (TSVs)
App 20200279793 - XIE; Jianyong ; et al. | 2020-09-03 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20200235449 - ELSHERBINI; Adel A. ; et al. | 2020-07-23 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs
Grant 10,651,525 - Elsherbini , et al. | 2020-05-12 |
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling
App 20200066641 - AYGUN; Kemal ; et al. | 2020-02-27 |
Simplified Multimode Signaling Techniques
App 20200021330 - Mekonnen; Yidnekachew S. ; et al. | 2020-01-16 |
Multiple Die Package Using An Embedded Bridge Connecting Dies
App 20190363049 - MEKONNEN; Yidnekachew S. ; et al. | 2019-11-28 |
Package Power Delivery Using Plane And Shaped Vias
App 20190355636 - Bharath; Krishna ; et al. | 2019-11-21 |
Package power delivery using plane and shaped vias
Grant 10,410,939 - Bharath , et al. Sept | 2019-09-10 |
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contact
Grant 10,396,036 - Zhang , et al. A | 2019-08-27 |
Interconnector With Bundled Interconnects
App 20190252321 - Braunisch; Henning ; et al. | 2019-08-15 |
Package-integrated microchannels
Grant 10,186,465 - Eid , et al. Ja | 2019-01-22 |
Rlink-ground Shielding Attachment Structures And Shadow Voiding For Data Signal Contacts Of Package Devices; Vertical Ground Shielding Structures And Shield Fencing Of Vertical Data Signal Interconnects Of Package Devices; And Ground Shielding For Electro Optical Module Connector Data Signal Contact
App 20180331043 - ZHANG; Yu Amos ; et al. | 2018-11-15 |
Improved Package Power Delivery Using Plane And Shaped Vias
App 20180331003 - BHARATH; Krishna ; et al. | 2018-11-15 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20180288868 - ELSHERBINI; Adel A. ; et al. | 2018-10-04 |
Low loss and low cross talk transmission lines using shaped vias
Grant 9,992,859 - Elsherbini , et al. June 5, 2 | 2018-06-05 |
Integrated Circuit Package Stack
App 20180005989 - Jayaraman; Saikumar ; et al. | 2018-01-04 |
Integrated circuit package stack
Grant 9,859,253 - Jayaraman , et al. January 2, 2 | 2018-01-02 |
Low Loss and Low Cross Talk Transmission Lines using Shaped Vias
App 20170093007 - ELSHERBINI; Adel A. ; et al. | 2017-03-30 |
Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects
Grant 9,515,031 - Altunyurt , et al. December 6, 2 | 2016-12-06 |
Mitigation Of Far-end Crosstalk Induced By Routing And Out-of-plane Interconnects
App 20140203417 - Altunyurt; Nevin ; et al. | 2014-07-24 |
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