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Patent applications and USPTO patent grants for MEKONNEN; Yidnekachew.The latest application filed is for "horizontal pitch translation using embedded bridge dies".
Patent | Date |
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Horizontal Pitch Translation Using Embedded Bridge Dies App 20220157706 - SHARAN; Sujit ;   et al. | 2022-05-19 |
Horizontal pitch translation using embedded bridge dies Grant 11,276,635 - Sharan , et al. March 15, 2 | 2022-03-15 |
Method to achieve variable dielectric thickness in packages for better electrical performance Grant 11,145,583 - Raorane , et al. October 12, 2 | 2021-10-12 |
Horizontal Pitch Translation Using Embedded Bridge Dies App 20200381350 - SHARAN; Sujit ;   et al. | 2020-12-03 |
Tunable Passive Semiconductor Elements App 20200203337 - Zhang; Zhichao ;   et al. | 2020-06-25 |
Method To Achieve Variable Dielectric Thickness In Packages For Better Electrical Performance App 20190341342 - RAORANE; Digvijay ;   et al. | 2019-11-07 |
Package-integrated Microchannels App 20180226310 - EID; Feras ;   et al. | 2018-08-09 |
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