MEISNER; Stephen Arlon

Patent Applications and Registrations

Patent applications and USPTO patent grants for MEISNER; Stephen Arlon.The latest application filed is for "integrated circuits having dielectric layers including an anti-reflective coating".

Company Profile

5.10.11

MEISNER; Stephen Arlon - Allen TX
Meisner; Stephen Arlon - St. Cloud FL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuits Having Dielectric Layers Including An Anti-reflective Coating App 20220069067 - FERNANDES; Poornika ; et al.	2022-03-03
Integrated Circuit With Scribe Lane Patterns For Defect Reduction App 20210398910 - SALINAS; Adrian ; et al.	2021-12-23
Integrated circuit with scribe lane patterns for defect reduction Grant 11,094,644 - Salinas , et al. August 17, 2	2021-08-17
Integrated Circuit With Scribe Lane Patterns For Defect Reduction App 20210104468 - SALINAS; Adrian ; et al.	2021-04-08
Integrated Circuits Having Dielectric Layers Including An Anti-reflective Coating App 20210098565 - FERNANDES; Poornika ; et al.	2021-04-01
Analog capacitor on submicron pitch metal level Grant 10,608,075 - Srinivasan , et al.	2020-03-31
Analog Capacitor On Submicron Pitch Metal Level App 20190157379 - Srinivasan; Bhaskar ; et al.	2019-05-23
Analog capacitor on submicron pitch metal level Grant 10,177,215 - Srinivasan , et al. J	2019-01-08
Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer Grant 8,466,569 - Meisner , et al. June 18, 2	2013-06-18
Capacitor contact formed concurrently with bond pad metallization Grant 8,431,463 - Lippitt, III , et al. April 30, 2	2013-04-30
Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom Grant 8,236,703 - Griffin, Jr. , et al. August 7, 2	2012-08-07
Process and Method for a Decoupled Multi-Parameter Run-to-Run Controller App 20110029119 - RAMAVAJJALA; Madhu Sudan ; et al.	2011-02-03
Capacitor Contact Formed Concurrently With Bond Pad Metallization App 20100032803 - Lippitt, III; Maxwell Walthour ; et al.	2010-02-11
Increasing Exposure Tool Alignment Signal Strength for a Ferroelectric Capacitor Layer App 20090243123 - Meisner; Stephen Arlon ; et al.	2009-10-01
Methods For Removing Contaminants From Aluminum-comprising Bond Pads And Integrated Circuits Therefrom App 20090068847 - Griffin, JR.; Alfred J. ; et al.	2009-03-12
Overlay metrology using scatterometry profiling Grant 6,985,229 - Lee , et al. January 10, 2	2006-01-10
Multiple purpose reticle layout for selective printing of test circuits Grant 6,893,806 - Bollinger , et al. May 17, 2	2005-05-17
Overlay metrology using scatterometry profiling App 20030223066 - Lee, Cynthia C. ; et al.	2003-12-04
Multiple purpose reticle layout for selective printing of test circuits App 20030039928 - Bollinger, Cheryl Anne ; et al.	2003-02-27

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