Meikle; Scott G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Meikle; Scott G..The latest application filed is for "method and apparatus for removing adjacent conductive and non-conductive materials of a microelectronic substrate".

Company Profile

0.73.60

Meikle; Scott G. - Gainesville VA
Meikle; Scott G. - Boise ID
Meikle; Scott G - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for removing metal layers formed outside an aperture of a BPSG layer utilizing multiple etching processes including electrochemical-mechanical polishing Grant 8,048,756 - Lee , et al. November 1, 2	2011-11-01
Method for selectively removing conductive material from a microelectronic substrate Grant 8,048,287 - Lee , et al. November 1, 2	2011-11-01
Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate Grant 7,972,485 - Lee , et al. July 5, 2	2011-07-05
Method And Apparatus For Removing Adjacent Conductive And Non-conductive Materials Of A Microelectronic Substrate App 20100176083 - Lee; Whonchee ; et al.	2010-07-15
Method for forming a microelectronic structure having a conductive material and a fill material with a hardness of 0.04 GPA or higher within an aperture Grant 7,700,436 - Lee , et al. April 20, 2	2010-04-20
Methods And Apparatus For Selectively Removing Conductive Material From A Microelectronic Substrate App 20100032314 - Lee; Whonchee ; et al.	2010-02-11
Methods And Apparatus For Electromechanically And/or Electrochemically-mechanically Removing Conductive Material From A Microelectronic Substrate App 20100006428 - Lee; Whonchee ; et al.	2010-01-14
Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate Grant 7,618,528 - Lee , et al. November 17, 2	2009-11-17
Methods and apparatus for selectively removing conductive material from a microelectronic substrate Grant 7,604,729 - Lee , et al. October 20, 2	2009-10-20
Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate Grant 7,588,677 - Lee , et al. September 15, 2	2009-09-15
Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium Grant 7,560,017 - Lee , et al. July 14, 2	2009-07-14
Turbidity monitoring methods, apparatuses, and sensors Grant 7,538,880 - Moore , et al. May 26, 2	2009-05-26
Semiconductor processor systems, a system configured to provide a semiconductor workpiece process fluid Grant 7,530,877 - Moore , et al. May 12, 2	2009-05-12
Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates Grant 7,374,476 - Meikle May 20, 2	2008-05-20
Semiconductor processing methods of removing conductive material Grant 7,367,871 - Doan , et al. May 6, 2	2008-05-06
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 7,276,446 - Robinson , et al. October 2, 2	2007-10-02
Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate Grant 7,220,166 - Lee , et al. May 22, 2	2007-05-22
Methods And Apparatus For Electromechanically And/or Electrochemically-mechanically Removing Conductive Material From A Microelectronic Substrate App 20070111641 - Lee; Whonchee ; et al.	2007-05-17
Method And Apparatus For Forming A Planarizing Pad Having A Film And Texture Elements For Planarization Of Microelectronic Substrates App 20070080142 - Meikle; Scott G.	2007-04-12
Method And Apparatus For Forming A Planarizing Pad Having A Film And Texture Elements For Planarization Of Microelectronic Substrates App 20070079933 - Meikle; Scott G.	2007-04-12
Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates Grant 7,192,335 - Lee , et al. March 20, 2	2007-03-20
Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods Grant 7,180,591 - Moore , et al. February 20, 2	2007-02-20
Methods and apparatus for selectively removing conductive material from a microelectronic substrate App 20070037490 - Lee; Whonchee ; et al.	2007-02-15
Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor App 20070015443 - Moore; Scott E. ; et al.	2007-01-18
Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate Grant 7,160,176 - Lee , et al. January 9, 2	2007-01-09
Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces Grant 7,153,410 - Moore , et al. December 26, 2	2006-12-26
Methods and apparatus for selectively removing conductive material from a microelectronic substrate Grant 7,153,195 - Lee , et al. December 26, 2	2006-12-26
Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates Grant 7,151,056 - Meikle December 19, 2	2006-12-19
Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium Grant 7,134,934 - Lee , et al. November 14, 2	2006-11-14
Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium App 20060249397 - Lee; Whonchee ; et al.	2006-11-09
Planarization process for semiconductor substrates App 20060249723 - Doan; Trung T. ; et al.	2006-11-09
Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate App 20060234604 - Lee; Whonchee ; et al.	2006-10-19
Semiconductor workpiece processing methods Grant 7,118,455 - Moore , et al. October 10, 2	2006-10-10
Semiconductor workpiece processing methods Grant 7,118,447 - Moore , et al. October 10, 2	2006-10-10
Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor Grant 7,118,445 - Moore , et al. October 10, 2	2006-10-10
Semiconductor processing methods of removing conductive material App 20060223425 - Doan; Trung Tri ; et al.	2006-10-05
Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate Grant 7,112,121 - Lee , et al. September 26, 2	2006-09-26
Method and apparatus for removing adjacent conductive and non-conductive materials of a microelectronic substrate App 20060208322 - Lee; Whonchee ; et al.	2006-09-21
Method and apparatus for removing adjacent conductive and non-conductive materials of a microelectronic substrate App 20060199351 - Lee; Whonchee ; et al.	2006-09-07
Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material Grant 7,094,131 - Lee , et al. August 22, 2	2006-08-22
Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate Grant 7,078,308 - Lee , et al. July 18, 2	2006-07-18
Semiconductor processing methods of removing conductive material Grant 7,056,194 - Doan , et al. June 6, 2	2006-06-06
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,964,602 - Chopra , et al. November 15, 2	2005-11-15
Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines App 20050191948 - Agarwal, Vishnu K. ; et al.	2005-09-01
Semiconductor processor control systems App 20050185180 - Moore, Scott E. ; et al.	2005-08-25
Methods of preparing semiconductor workpiece process fluid App 20050153632 - Moore, Scott E. ; et al.	2005-07-14
Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices Grant 6,913,997 - Akram , et al. July 5, 2	2005-07-05
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies App 20050107010 - Robinson, Karl M. ; et al.	2005-05-19
Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines Grant 6,890,591 - Agarwal , et al. May 10, 2	2005-05-10
Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate App 20050034999 - Lee, Whonchee ; et al.	2005-02-17
Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates App 20050037696 - Meikle, Scott G.	2005-02-17
Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate App 20050035000 - Lee, Whonchee ; et al.	2005-02-17
Semiconductor processor control systems, semiconductor processor systems, and systems configured to provide a semiconductor workpiece process fluid App 20050026547 - Moore, Scott E. ; et al.	2005-02-03
Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates App 20050020192 - Lee, Whonchee ; et al.	2005-01-27
Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates Grant 6,838,382 - Meikle January 4, 2	2005-01-04
Semiconductor processing methods of removing conductive material App 20040221956 - Doan, Trung Tri ; et al.	2004-11-11
Planarization process for semiconductor substrates App 20040209475 - Doan, Trung T. ; et al.	2004-10-21
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 6,805,615 - Robinson , et al. October 19, 2	2004-10-19
Turbidity monitoring methods, apparatuses, and sensors App 20040198183 - Moore, Scott E. ; et al.	2004-10-07
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20040192176 - Chopra, Dinesh ; et al.	2004-09-30
Semiconductor processing methods of removing conductive material Grant 6,790,130 - Doan , et al. September 14, 2	2004-09-14
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,746,316 - Chopra , et al. June 8, 2	2004-06-08
Planarization process for semiconductor substrates Grant 6,743,724 - Doan , et al. June 1, 2	2004-06-01
Semiconductor processing methods of removing conductive material App 20040087251 - Doan, Trung Tri ; et al.	2004-05-06
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,716,090 - Chopra , et al. April 6, 2	2004-04-06
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,712,676 - Chopra , et al. March 30, 2	2004-03-30
Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate App 20040043629 - Lee, Whonchee ; et al.	2004-03-04
Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates App 20040043705 - Lee, Whonchee ; et al.	2004-03-04
Antireflective coating and field emission display device, semiconductor device and wiring line comprising same Grant 6,690,077 - McTeer , et al. February 10, 2	2004-02-10
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,672,946 - Chopra , et al. January 6, 2	2004-01-06
Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces App 20030226764 - Moore, Scott E. ; et al.	2003-12-11
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,652,365 - Chopra , et al. November 25, 2	2003-11-25
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,652,364 - Chopra , et al. November 25, 2	2003-11-25
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,648,736 - Chopra , et al. November 18, 2	2003-11-18
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,638,148 - Chopra , et al. October 28, 2	2003-10-28
Methods of preparing semiconductor workpiece process fluid and semiconductor workpiece processing methods App 20030199227 - Moore, Scott E. ; et al.	2003-10-23
Reduction of surface roughness during chemical mechanical planarization (CMP) Grant 6,630,403 - Kramer , et al. October 7, 2	2003-10-07
Tantalum-aluminum-nitrogen material for semiconductor devices Grant 6,611,061 - Akram , et al. August 26, 2	2003-08-26
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,609,957 - Chopra , et al. August 26, 2	2003-08-26
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 6,599,836 - Robinson , et al. July 29, 2	2003-07-29
Methods and apparatus for selectively removing conductive material from a microelectronic substrate App 20030129927 - Lee, Whonchee ; et al.	2003-07-10
Semiconductor processing methods of removing conductive material Grant 6,582,281 - Doan , et al. June 24, 2	2003-06-24
Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium App 20030109198 - Lee, Whonchee ; et al.	2003-06-12
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030073388 - Chopra, Dinesh ; et al.	2003-04-17
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030073387 - Chopra, Dinesh ; et al.	2003-04-17
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030073389 - Chopra, Dinesh ; et al.	2003-04-17
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies of planarizing pads App 20030073390 - Chopra, Dinesh ; et al.	2003-04-17
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030068962 - Chopra, Dinesh ; et al.	2003-04-10
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030068961 - Chopra, Dinesh ; et al.	2003-04-10
Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate App 20030054729 - Lee, Whonchee ; et al.	2003-03-20
Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor App 20030022593 - Moore, Scott E. ; et al.	2003-01-30
Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices App 20020197857 - Akram, Salman ; et al.	2002-12-26
Reduction of surface roughness during chemical mechanical planarization (CMP) App 20020182868 - Kramer, Stephen J. ; et al.	2002-12-05
Tantalum - aluminum - nitrogen material for semiconductor devices App 20020100981 - Akram, Salman ; et al.	2002-08-01
Method for removing an upper layer of material from a semiconductor wafer Grant 6,426,288 - Meikle July 30, 2	2002-07-30
Graded layer for use in semiconductor circuits and method for making same App 20020094652 - Akram, Salman ; et al.	2002-07-18
Method for forming a planar surface over low density field areas on a semiconductor wafer Grant 6,395,620 - Pan , et al. May 28, 2	2002-05-28
Semiconductor processing methods of removing conductive material App 20020061714 - Doan, Trung Tri ; et al.	2002-05-23
Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines Grant 6,361,832 - Agarwal , et al. March 26, 2	2002-03-26
Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material App 20020025759 - Lee, Whonchee ; et al.	2002-02-28
Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate App 20020025763 - Lee, Whonchee ; et al.	2002-02-28
Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate App 20020025760 - Lee, Whonchee ; et al.	2002-02-28
Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines App 20020018848 - Argarwal, Vishnu K. ; et al.	2002-02-14
Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates App 20020009886 - Chopra, Dinesh ; et al.	2002-01-24
Planarization process for semiconductor substrates Grant 6,331,488 - Doan , et al. December 18, 2	2001-12-18
Planarization process for semiconductor substrates App 20010051430 - Doan, Trung T. ; et al.	2001-12-13
Semiconductor structure with a titanium aluminum nitride layer and method for fabricating same App 20010040293 - Meikle, Scott G. ; et al.	2001-11-15
Graded layer for use in semiconductor circuits and method for making same App 20010033027 - Akram, Salman ; et al.	2001-10-25
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20010031550 - Chopra, Dinesh ; et al.	2001-10-18
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20010024935 - Chopra, Dinesh ; et al.	2001-09-27
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20010021628 - Chopra, Dinesh ; et al.	2001-09-13
Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines App 20010019940 - Agarwal, Vishnu K. ; et al.	2001-09-06
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20010018318 - Chopra, Dinesh ; et al.	2001-08-30
Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad Grant 6,273,786 - Chopra , et al. August 14, 2	2001-08-14
Graded layer for use in semiconductor circuits and method for making same Grant 6,271,590 - Akram , et al. August 7, 2	2001-08-07
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,250,994 - Chopra , et al. June 26, 2	2001-06-26
Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad Grant 6,206,756 - Chopra , et al. March 27, 2	2001-03-27
Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines Grant 6,206,759 - Agarwal , et al. March 27, 2	2001-03-27
Non-knurled induction coil for ionized metal deposition, sputtering apparatus including same, and method of constructing the apparatus Grant 6,168,696 - Burton , et al. January 2, 2	2001-01-02
Tantalum-aluminum-nitrogen material for semiconductor devices Grant 6,133,636 - Akram , et al. October 17, 2	2000-10-17
Method and apparatus for predicting process characteristics of polyurethane pads Grant 6,114,706 - Meikle , et al. September 5, 2	2000-09-05
Antireflective coating and wiring line stack Grant 6,040,613 - McTeer , et al. March 21, 2	2000-03-21
Method for removing an upper layer of material from a semiconductor wafer Grant 5,942,449 - Meikle August 24, 1	1999-08-24
Tantalum-aluminum-nitrogen material for semiconductor devices Grant 5,892,281 - Akram , et al. April 6, 1	1999-04-06
Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers Grant 5,801,066 - Meikle September 1, 1	1998-09-01
Method of chemical mechanical polishing for dielectric layers Grant 5,795,495 - Meikle August 18, 1	1998-08-18
Polishing pad with elongated microcolumns Grant 5,795,218 - Doan , et al. August 18, 1	1998-08-18
Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers Grant 5,655,951 - Meikle , et al. August 12, 1	1997-08-12
Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers Grant 5,609,718 - Meikle March 11, 1	1997-03-11
Method and appartus for subliming precursors Grant 5,377,429 - Sandhu , et al. January 3, 1	1995-01-03
Low resistance device element and interconnection structure Grant 5,341,016 - Prall , et al. August 23, 1	1994-08-23
Method of depositing high density titanium nitride films on semiconductor wafers Grant 5,254,499 - Sandhu , et al. October 19, 1	1993-10-19
Titanium/aluminum/nitrogen material for semiconductor devices Grant 5,231,306 - Meikle , et al. July 27, 1	1993-07-27