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Stud capacitor device and fabrication method
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Member for reinforcing, sealing or baffling and reinforcement system formed therewith
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Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
Grant 6,911,111 - Chopra , et al. June 28, 2 | 2005-06-28 |
Electro-mechanically polished structure
Grant 6,867,448 - Lee , et al. March 15, 2 | 2005-03-15 |
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
App 20040206454 - Chopra, Dinesh ; et al. | 2004-10-21 |
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
App 20040206374 - Chopra, Dinesh ; et al. | 2004-10-21 |
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
Grant 6,736,926 - Chopra , et al. May 18, 2 | 2004-05-18 |
Method of depositing tungsten nitride using a source gas comprising silicon
Grant 6,730,954 - Meikle , et al. May 4, 2 | 2004-05-04 |
Method and apparatus for uniformly planarizing a microelectronic substrate
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App 20040040863 - Lee, Whonchee ; et al. | 2004-03-04 |
Method and apparatus for uniformly planarizing a microelectronic substrate
Grant 6,652,363 - Kramer , et al. November 25, 2 | 2003-11-25 |
Electro-mechanical polishing of platinum container structure
Grant 6,605,539 - Lee , et al. August 12, 2 | 2003-08-12 |
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
App 20030066548 - Chopra, Dinesh ; et al. | 2003-04-10 |
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
App 20030060139 - Sabde, Gundu M. ; et al. | 2003-03-27 |
Method of depositing tungsten nitride using a source gas comprising silicon
Grant 6,472,323 - Meikle , et al. October 29, 2 | 2002-10-29 |
Method and apparatus for uniformly planarizing a microelectronic substrate
App 20020127955 - Kramer, Stephen J. ; et al. | 2002-09-12 |
Method and apparatus for uniformly planarizing a microelectronic substrate
App 20020111124 - Kramer, Stephen J. ; et al. | 2002-08-15 |
Method and apparatus for uniformly planarizing a microelectronic substrate
App 20020111123 - Kramer, Stephen J. ; et al. | 2002-08-15 |
Method of depositing tungsten nitride using a source gas comprising silicon
Grant 6,429,086 - Meikle , et al. August 6, 2 | 2002-08-06 |
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
App 20020072311 - Sabde, Gundu M. ; et al. | 2002-06-13 |
Electro-mechanical polishing of platinum container structure
App 20020052126 - Lee, Whonchee ; et al. | 2002-05-02 |
Method of depositing tungsten nitride using a source gas comprising silicon
App 20020045322 - Meikle, Scott ; et al. | 2002-04-18 |
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
App 20010024928 - Sabde, Gundu M. ; et al. | 2001-09-27 |
Planarization method using fluid composition including chelating agents
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Method and apparatus for uniformly planarizing a microelectronic substrate
App 20010000772 - Kramer, Stephen J. ; et al. | 2001-05-03 |
Method and apparatus for uniformly planarizing a microelectronic substrate
Grant 6,176,763 - Kramer , et al. January 23, 2 | 2001-01-23 |
Planarization process with abrasive polishing slurry that is selective to a planarized surface
Grant 6,062,952 - Robinson , et al. May 16, 2 | 2000-05-16 |
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Planarization fluid composition chelating agents and planarization method using same
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Under-pad for chemical-mechanical planarization of semiconductor wafers
Grant 5,871,392 - Meikle , et al. February 16, 1 | 1999-02-16 |
Method of depositing tungsten nitride using a source gas comprising silicon
Grant 5,691,235 - Meikle , et al. November 25, 1 | 1997-11-25 |
Method of chimical mechanical polishing for dielectric layers
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Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes
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Optical end point detection methods in semiconductor planarizing polishing processes
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Chemical-mechanical polishing processes of planarizing insulating layers
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Method for shaping features of a semiconductor structure using chemical mechanical planarization (CMP)
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