loadpatents
name:-0.0027830600738525
name:-0.0072288513183594
name:-0.00040292739868164
Meier; Max Patent Filings

Meier; Max

Patent Applications and Registrations

Patent applications and USPTO patent grants for Meier; Max.The latest application filed is for "pipe-connection moulded part having thermal insulation and method of producing the pipe-connection moulded part".

Company Profile
0.6.1
  • Meier; Max - Luterkofen CH
  • Meier; Max - Lichtenau DE
  • Meier; Max - St. Antoni CH
  • Meier; Max - D-7585 Lichtenau-Scherzheim DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Pipe-connection Moulded Part Having Thermal Insulation And Method Of Producing The Pipe-connection Moulded Part
App 20080084059 - Meier; Max ;   et al.
2008-04-10
Method of manufacturing a plastic edged glass shelf
Grant 6,120,720 - Meier , et al. September 19, 2
2000-09-19
Table or cover plate
Grant 5,830,552 - Meier , et al. November 3, 1
1998-11-03
Table or cover plate
Grant 5,436,048 - Meier , et al. July 25, 1
1995-07-25
Weldable connecting member for connecting or joining thermoplastic pipe elements
Grant 4,703,150 - Kunnecke , et al. October 27, 1
1987-10-27
Use of tertiary phosphines in photographic silver dye bleach materials
Grant 4,357,280 - Chylewski , et al. November 2, 1
1982-11-02
Coated boards of wooden material in particular for use in furniture
Grant 4,336,294 - Meier June 22, 1
1982-06-22

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