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Mei; Penglin Patent Filings

Mei; Penglin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mei; Penglin.The latest application filed is for "semiconductor device with heat spreader".

Company Profile
0.8.8
  • Mei; Penglin - Tianjin N/A CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device with heat spreader
Grant 9,484,289 - Ge , et al. November 1, 2
2016-11-01
Semiconductor package with stress relief and heat spreader
Grant 9,196,576 - Yow , et al. November 24, 2
2015-11-24
Semiconductor Device With Heat Spreader
App 20150108625 - Ge; You ;   et al.
2015-04-23
Semiconductor Package With Stress Relief And Heat Spreader
App 20150084169 - Yow; Kai Yun ;   et al.
2015-03-26
Lead frame based semiconductor device with routing substrate
Grant 8,980,690 - Mei , et al. March 17, 2
2015-03-17
Semiconductor device with integral heat sink
Grant 8,901,722 - Ge , et al. December 2, 2
2014-12-02
Semiconductor Device With Integral Heat Sink
App 20140239476 - Ge; You ;   et al.
2014-08-28
Semiconductor Device And Method Of Packaging Same
App 20130020689 - Mei; Penglin ;   et al.
2013-01-24

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