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Patent applications and USPTO patent grants for Mei; Penglin.The latest application filed is for "semiconductor device with heat spreader".
Patent | Date |
---|---|
Semiconductor device with heat spreader Grant 9,484,289 - Ge , et al. November 1, 2 | 2016-11-01 |
Semiconductor package with stress relief and heat spreader Grant 9,196,576 - Yow , et al. November 24, 2 | 2015-11-24 |
Semiconductor Device With Heat Spreader App 20150108625 - Ge; You ;   et al. | 2015-04-23 |
Semiconductor Package With Stress Relief And Heat Spreader App 20150084169 - Yow; Kai Yun ;   et al. | 2015-03-26 |
Lead frame based semiconductor device with routing substrate Grant 8,980,690 - Mei , et al. March 17, 2 | 2015-03-17 |
Semiconductor device with integral heat sink Grant 8,901,722 - Ge , et al. December 2, 2 | 2014-12-02 |
Semiconductor Device With Integral Heat Sink App 20140239476 - Ge; You ;   et al. | 2014-08-28 |
Semiconductor Device And Method Of Packaging Same App 20130020689 - Mei; Penglin ;   et al. | 2013-01-24 |
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