loadpatents
name:-0.012727975845337
name:-0.0092828273773193
name:-0.001060962677002
Mei; Junfa Patent Filings

Mei; Junfa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mei; Junfa.The latest application filed is for "method of repairing a component".

Company Profile
0.7.9
  • Mei; Junfa - Birmingham GB
  • MEI; Junfa - Melbourne AU
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Joining and a repair method
Grant 8,821,785 - Voice , et al. September 2, 2
2014-09-02
Method of manufacturing a component
Grant 8,758,676 - Voice , et al. June 24, 2
2014-06-24
Joining method and resultant article
Grant 8,322,595 - Voice , et al. December 4, 2
2012-12-04
Method Of Repairing A Component
App 20120211548 - CLARK; Daniel ;   et al.
2012-08-23
Mould Assembly For A Hot Isostatic Pressing Process
App 20120100032 - VOICE; Wayne E. ;   et al.
2012-04-26
Method Of Manufacturing A Component
App 20110142709 - VOICE; Wayne E. ;   et al.
2011-06-16
Manufacture of an article by hot isostatic pressing
App 20100158742 - Voice; Wayne E. ;   et al.
2010-06-24
Joining and a repair method
App 20100129255 - Voice; Wayne E. ;   et al.
2010-05-27
Joining Method And Resultant Article
App 20090072010 - Voice; Wayne Eric ;   et al.
2009-03-19
Method of manufacturing a metal article by powder metallurgy
Grant 7,407,622 - Voice , et al. August 5, 2
2008-08-05
Method of manufacturing a metal article by powder metallurgy
App 20060127265 - Voice; Wayne E. ;   et al.
2006-06-15
Abradable seals
Grant 7,029,232 - Tuffs , et al. April 18, 2
2006-04-18
Apparatus and a method of manufacturing an article by consolidating powder material
App 20050142023 - Voice, Wayne E. ;   et al.
2005-06-30
Abradable seals
App 20040265120 - Tuffs, Martin ;   et al.
2004-12-30

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