MEHTA; Vipul

Patent Applications and Registrations

Patent applications and USPTO patent grants for MEHTA; Vipul.The latest application filed is for "hydrophobic feature to control adhesive flow".

Company Profile

6.1.10

MEHTA; Vipul - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hydrophobic Feature To Control Adhesive Flow App 20220196937 - ZIADEH; Bassam ; et al.	2022-06-23
Micro-electronic Package With Substrate Protrusion To Facilitate Dispense Of Underfill Between A Narrow Die-to-die Gap App 20220165585 - LIN; Ziyin ; et al.	2022-05-26
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap Grant 11,282,717 - Lin , et al. March 22, 2	2022-03-22
High Thermal Conductivity, High Modulus Structure Within A Mold Material Layer Of An Integrated Circuit Package App 20210272878 - Bai; Yiqun ; et al.	2021-09-02
Barrier Structures For Underfill Containment App 20210249322 - Lin; Ziyin ; et al.	2021-08-12
Semiconductor Die Package With Warpage Management And Process For Forming Such App 20210066152 - LIN; Ziyin ; et al.	2021-03-04
Semiconductor Package With Attachment And/or Stop Structures App 20210066162 - CHAN ARGUEDAS; Sergio A. ; et al.	2021-03-04
Trenches In Wafer Level Packages For Improvements In Warpage Reliability And Thermals App 20210035859 - MEHTA; Vipul ; et al.	2021-02-04
Protruding Sn Substrate Features For Epoxy Flow Control App 20210020531 - CETEGEN; Edvin ; et al.	2021-01-21
Micro-electronic Package With Barrier Structure App 20200006169 - WARREN; William ; et al.	2020-01-02
Micro-electronic Package With Substrate Protrusion To Facilitate Dispense Of Underfill Between A Narrow Die-to-die Gap App 20190304808 - LIN; Ziyin ; et al.	2019-10-03

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