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name:-0.0064389705657959
name:-0.010310888290405
name:-0.003349781036377
Mehr; Behrooz Patent Filings

Mehr; Behrooz

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mehr; Behrooz.The latest application filed is for "lead frames for semiconductor packages with increased reliability and related semiconductor device packages and methods".

Company Profile
1.7.6
  • Mehr; Behrooz - Chandler AZ
  • Mehr; Behrooz - San Jose CA
  • Mehr; Behrooz - Palo Alto CA
  • Mehr; Behrooz - Tempe AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Lead frames for semiconductor packages with increased reliability and related semiconductor device packages and methods
Grant 11,430,718 - Mehr August 30, 2
2022-08-30
Lead Frames For Semiconductor Packages With Increased Reliability And Related Semiconductor Device Packages And Methods
App 20220246499 - Mehr; Behrooz
2022-08-04
Grounding Techniques For Backside-biased Semiconductor Dice And Related Devices, Systems And Methods
App 20200365530 - Mehr; Behrooz ;   et al.
2020-11-19
Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods
Grant 10,741,507 - Mehr , et al. A
2020-08-11
Grounding Techniques For Backside-biased Semiconductor Dice And Related Devices, Systems And Methods
App 20180233463 - Mehr; Behrooz ;   et al.
2018-08-16
Multi-layer capacitor using dielectric layers having differing compositions
App 20060001068 - Mosley; Larry E. ;   et al.
2006-01-05
Capacitor method and apparatus
Grant 6,924,970 - Mehr , et al. August 2, 2
2005-08-02
Capacitor method and apparatus
App 20040125535 - Mehr, Behrooz ;   et al.
2004-07-01
Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias
Grant 5,936,848 - Mehr , et al. August 10, 1
1999-08-10
Drop-in heat sink
Grant 5,530,295 - Mehr June 25, 1
1996-06-25
Slotted thermal dissipater for a semiconductor package
Grant 5,489,805 - Hackitt , et al. February 6, 1
1996-02-06
Method of making a drop-in heat sink
Grant 5,444,909 - Mehr August 29, 1
1995-08-29

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