Mehaffy; Justin A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mehaffy; Justin A..The latest application filed is for "integrated low application temperature hot melt adhesive processing system".
- Mehaffy; Justin A. - Hampton NJ
- Mehaffy; Justin A. - Flemington NJ
| Patent | Date |
|---|---|
| Integrated low application temperature hot melt adhesive processing system Grant 8,225,963 - Mehaffy , et al. July 24, 2 | 2012-07-24 |
| Hot melt adhesive Grant 7,208,541 - Gong , et al. April 24, 2 | 2007-04-24 |
| Integrated low application temperature hot melt adhesive processing system App 20070080157 - Mehaffy; Justin A. ; et al. | 2007-04-12 |
| Hot melt adhesive composition Grant 7,199,204 - Haner , et al. April 3, 2 | 2007-04-03 |
| Hot melt adhesive Grant 7,148,284 - Morrison , et al. December 12, 2 | 2006-12-12 |
| Low application temperature hot melt adhesive App 20060116459 - Morrison; Brian D. ; et al. | 2006-06-01 |
| Low application temperature hot melt adhesive Grant 7,019,060 - Morrison , et al. March 28, 2 | 2006-03-28 |
| System for dispensing viscous liquids App 20050274740 - Duckworth, David ; et al. | 2005-12-15 |
| Hot melt adhesive App 20050261416 - Morrison, Brian D. ; et al. | 2005-11-24 |
| Hot melt adhesive App 20050042469 - Gong, Lie-zhong ; et al. | 2005-02-24 |
| Hot melt adhesive App 20050003197 - Good, David J. ; et al. | 2005-01-06 |
| Packaging system App 20040164135 - Gong, Lie-zhong ; et al. | 2004-08-26 |
| Packaging system App 20040164134 - Gong, Lie-Zhong ; et al. | 2004-08-26 |
| Hot melt adhesive composition App 20040167258 - Drogou, Cecile ; et al. | 2004-08-26 |
| Reactivatable adhesive App 20040166309 - Gong, Lie-Zhong ; et al. | 2004-08-26 |
| Hot melt adhesive composition App 20030212202 - Haner, Dale I. ; et al. | 2003-11-13 |
| Reactivatable adhesives App 20030041963 - Gong, Lie-zhong ; et al. | 2003-03-06 |
| Low application temperature hot melt adhesive Grant 6,117,945 - Mehaffy , et al. September 12, 2 | 2000-09-12 |
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