Meguro; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Meguro; Koichi.The latest application filed is for "method for chip packaging".

Company Profile

0.6.9

Meguro; Koichi - Jiangsu CN
Meguro; Koichi - Nantong CN
MEGURO; Koichi - Setagaya JP
Meguro; Koichi - Kawasaki JP
Meguro, Koichi - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for chip package Grant 9,362,173 - Shi , et al. June 7, 2	2016-06-07
Method for chip packaging Grant 8,883,627 - Shi , et al. November 11, 2	2014-11-11
Method For Chip Packaging App 20130280904 - Shi; Lei ; et al.	2013-10-24
Method For Chip Package App 20130224910 - Shi; Lei ; et al.	2013-08-29
Wafer Level Package Structure And Method For Manufacturing The Same App 20130034934 - MEGURO; Koichi ; et al.	2013-02-07
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material Grant 7,056,770 - Uragami , et al. June 6, 2	2006-06-06
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material App 20040101631 - Uragami, Hiroshi ; et al.	2004-05-27
Method of manufacturing semiconductor device using heated conveyance member Grant 6,673,654 - Ohno , et al. January 6, 2	2004-01-06
Method of manufacturing semiconductor device using heated conveyance member App 20030077879 - Ohno, Takao ; et al.	2003-04-24
Method of manufacturing semiconductor device from semiconductor wafer having thick peripheral portion App 20030073264 - Meguro, Koichi ; et al.	2003-04-17

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