Meeder; Michael
Patent Applications and Registrations
Patent applications and USPTO patent grants for Meeder; Michael.The latest application filed is for "using an interconnect bump to traverse through a passivation layer of a semiconductor die".
- Meeder; Michael - Jamestown NC
| Patent | Date |
|---|---|
| Using an interconnect bump to traverse through a passivation layer of a semiconductor die Grant 10,777,524 - Morris , et al. Sept | 2020-09-15 |
| Using An Interconnect Bump To Traverse Through A Passivation Layer Of A Semiconductor Die App 20180366431 - Morris; Thomas Scott ; et al. | 2018-12-20 |
| Electrostatic discharge (ESD) protection of capacitors using lateral surface Schottky diodes Grant 9,698,137 - Zampardi , et al. July 4, 2 | 2017-07-04 |
| Esd Protection Of Capacitors Using Lateral Surface Schottky Diodes App 20170103976 - Zampardi; Peter J. ; et al. | 2017-04-13 |
| Using An Interconnect Bump To Traverse Through A Passivation Layer Of A Semiconductor Die App 20170018520 - Morris; Thomas Scott ; et al. | 2017-01-19 |
| Using An Interconnect Bump To Traverse Through A Passivation Layer Of A Semiconductor Die App 20140021603 - Morris; Thomas Scott ; et al. | 2014-01-23 |
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