McWilliams; Bruce M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for McWilliams; Bruce M..The latest application filed is for "method and system for pumping of an optical resonator".

Company Profile

1.6.13

McWilliams; Bruce M. - Atherton CA
McWilliams; Bruce M. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and system for pumping of an optical resonator Grant 10,199,793 - Bowers , et al. Fe	2019-02-05
Method And System For Pumping Of An Optical Resonator App 20170302049 - Bowers; Jeffrey A. ; et al.	2017-10-19
Method and system for pumping of an optical resonator Grant 9,698,558 - Bowers , et al. July 4, 2	2017-07-04
Method And System For Pumping Of An Optical Resonator App 20160301181 - Bowers; Jeffrey A. ; et al.	2016-10-13
Method and system for pumping of an optical resonator Grant 9,385,503 - Bowers , et al. July 5, 2	2016-07-05
Method And System For Pumping Of An Optical Resonator App 20150222075 - Bowers; Jeffrey A. ; et al.	2015-08-06
Method and system for pumping of an optical resonator Grant 9,048,621 - Bowers , et al. June 2, 2	2015-06-02
Method And System For Pumping Of An Optical Resonator App 20150016483 - Bowers; Jeffrey A. ; et al.	2015-01-15
Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture Grant 7,566,853 - Tuckerman , et al. July 28, 2	2009-07-28
Solder elements with columnar structures and methods of making the same App 20080036100 - McWilliams; Bruce M. ; et al.	2008-02-14
Structure and method of making sealed capped chips App 20080032457 - McWilliams; Bruce M. ; et al.	2008-02-07
Structure and method of making sealed capped chips Grant 7,298,030 - McWilliams , et al. November 20, 2	2007-11-20
Structure and method of making capped chip having discrete article assembled into vertical interconnect App 20070138644 - McWilliams; Bruce M. ; et al.	2007-06-21
Structure and method of making capped chips having vertical interconnects App 20070096311 - Humpston; Giles ; et al.	2007-05-03
Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture App 20070034777 - Tuckerman; David B. ; et al.	2007-02-15
Wafer Level Microelectronic Packaging With Double Isolation App 20060081983 - Humpston; Giles ; et al.	2006-04-20
Structure and method of making capped chips having vertical interconnects App 20050095835 - Humpston, Giles ; et al.	2005-05-05
Structure and method of making sealed capped chips App 20050082653 - McWilliams, Bruce M. ; et al.	2005-04-21
Structure and method of making capped chips using sacrificial layer App 20050085016 - McWilliams, Bruce M. ; et al.	2005-04-21

Company Registrations

SEC

0001269893

MCWILLIAMS BRUCE M

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