McShane; Michael B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for McShane; Michael B..The latest application filed is for "die stack address bus having a programmable width".

Company Profile

2.63.37

McShane; Michael B. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical die test interface with separate voltages for adjacent electrodes Grant 10,230,458 - McShane , et al.	2019-03-12
Defective die replacement in a die stack Grant 10,177,052 - Pelley , et al. J	2019-01-08
Die stack address bus having a programmable width Grant 10,002,653 - Pelley , et al. June 19, 2	2018-06-19
Optical backplane mirror Grant 9,810,843 - Stephens , et al. November 7, 2	2017-11-07
Optical redundancy Grant 9,766,409 - Pelley , et al. September 19, 2	2017-09-19
Thin low profile strip dual in-line memory module Grant 9,480,161 - Pelley , et al. October 25, 2	2016-10-25
Integration of a MEMS beam with optical waveguide and deflection in two dimensions Grant 9,435,952 - Stephens , et al. September 6, 2	2016-09-06
Microelectronic assembly having a heat spreader for a plurality of die Grant 9,431,380 - Stephens , et al. August 30, 2	2016-08-30
Die Stack Address Bus Having A Programmable Width App 20160118095 - Pelley; Perry H. ; et al.	2016-04-28
Wirebond recess for stacked die Grant 9,318,451 - Pham , et al. April 19, 2	2016-04-19
Optical wafer and die probe testing Grant 9,261,556 - McShane , et al. February 16, 2	2016-02-16
Defective Die Replacement In A Die Stack App 20150287653 - Pelley; Perry H. ; et al.	2015-10-08
Techniques for reducing inductance in through-die vias of an electronic assembly Grant 9,099,475 - McShane , et al. August 4, 2	2015-08-04
Microelectronic Assembly Having A Heat Spreader For A Plurality Of Die App 20150214208 - STEPHENS; Tab A. ; et al.	2015-07-30
Communication system die stack Grant 9,091,820 - Stephens , et al. July 28, 2	2015-07-28
Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices Grant 9,093,429 - McShane , et al. July 28, 2	2015-07-28
Die stack with optical TSVs Grant 9,094,135 - Pelley , et al. July 28, 2	2015-07-28
Thin Low Profile Strip Dual In-Line Memory Module App 20150208510 - Pelley; Perry H. ; et al.	2015-07-23
Edge coupling of semiconductor dies Grant 9,087,702 - Pham , et al. July 21, 2	2015-07-21
Stacked semiconductor devices Grant 9,082,757 - Pelley , et al. July 14, 2	2015-07-14
Stacked semiconductor die with continuous conductive vias Grant 9,076,664 - Pelley , et al. July 7, 2	2015-07-07
Microelectronic assembly having a heat spreader for a plurality of die Grant 9,070,653 - Stephens , et al. June 30, 2	2015-06-30
Stacked Semiconductor Devices App 20150115463 - PELLEY; PERRY H. ; et al.	2015-04-30
Wirebond Recess For Stacked Die App 20150115474 - PHAM; TIM V. ; et al.	2015-04-30
Gate security feature Grant 8,980,734 - Stephens , et al. March 17, 2	2015-03-17
Edge Coupling Of Semiconductor Dies App 20150061097 - Pham; Tim V. ; et al.	2015-03-05
Using an integrated circuit die configuration for package height reduction Grant 8,957,510 - Pham , et al. February 17, 2	2015-02-17
Using An Integrated Circuit Die Configuration For Package Height Reduction App 20150008567 - PHAM; TIM V. ; et al.	2015-01-08
Optical Backplane Mirror App 20140363120 - Stephens; Tab A. ; et al.	2014-12-11
Optical Redundancy App 20140363124 - Pelley; Perry H. ; et al.	2014-12-11
Optical Wafer and Die Probe Testing App 20140363905 - McShane; Michael B. ; et al.	2014-12-11
Integration of a MEMS Beam with Optical Waveguide and Deflection in Two Dimensions App 20140363119 - Stephens; Tab A. ; et al.	2014-12-11
Communication System Die Stack App 20140362425 - Stephens; Tab A. ; et al.	2014-12-11
Die Stack with Optical TSVs App 20140363172 - Pelley; Perry H. ; et al.	2014-12-11
Optical Die Test Interface App 20140363153 - McShane; Michael B. ; et al.	2014-12-11
Gate Security Feature App 20140252487 - Stephens; Tab A. ; et al.	2014-09-11
Stacked semiconductor devices Grant 8,796,822 - Pelley , et al. August 5, 2	2014-08-05
Semiconductor devices with nonconductive vias Grant 8,796,855 - Pelley , et al. August 5, 2	2014-08-05
Microelectronic Assembly Having A Heat Spreader For A Plurality Of Die App 20140197541 - STEPHENS; Tab A. ; et al.	2014-07-17
Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices Grant 8,680,674 - McShane , et al. March 25, 2	2014-03-25
Techniques For Reducing Inductance In Through-die Vias Of An Electronic Assembly App 20140071652 - MCSHANE; MICHAEL B. ; et al.	2014-03-13
Methods And Structures For Reducing Heat Exposure Of Thermally Sensitive Semiconductor Devices App 20140001641 - MCSHANE; MICHAEL B. ; et al.	2014-01-02
Methods And Structures For Reducing Heat Exposure Of Thermally Sensitive Semiconductor Devices App 20130320480 - Mcshane; Michael B. ; et al.	2013-12-05
Semiconductor device package Grant 8,501,539 - Hess , et al. August 6, 2	2013-08-06
Semiconductor Devices With Nonconductive Vias App 20130181350 - PELLEY; Perry H. ; et al.	2013-07-18
Stacked Semiconductor Devices App 20130087926 - Pelley; Perry H. ; et al.	2013-04-11
Stacked Semiconductor Devices App 20130088255 - PELLEY; PERRY H. ; et al.	2013-04-11
Package-to-package stacking by using interposer with traces, and or standoffs and solder balls App 20120020040 - Lin; Paul T. ; et al.	2012-01-26
Edge mounted integrated circuits with heat sink Grant 8,004,080 - McShane , et al. August 23, 2	2011-08-23
Semiconductor Device Package App 20110108965 - Hess; Kevin J. ; et al.	2011-05-12
Edge Mounted Integrated Circuits With Heat Sink App 20110057306 - McShane; Michael B. ; et al.	2011-03-10
High bandwidth cache-to-processing unit communication in a multiple processor/cache system Grant 7,777,330 - Pelley , et al. August 17, 2	2010-08-17
Technique For Packaging Multiple Integrated Circuits App 20100117242 - Miller; Gary L. ; et al.	2010-05-13
High Bandwidth Cache-to-processing Unit Communication In A Multiple Processor/cache System App 20090196086 - Pelley; Perry H. ; et al.	2009-08-06
Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same Grant 5,517,056 - Bigler , et al. May 14, 1	1996-05-14
Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding Grant 5,468,999 - Lin , et al. November 21, 1	1995-11-21
Method for making a lead-on-chip semiconductor device having peripheral bond pads Grant 5,455,200 - Bigler , et al. October 3, 1	1995-10-03
Thermally enhanced semiconductor device having exposed backside and method for making the same Grant 5,450,283 - Lin , et al. September 12, 1	1995-09-12
Lead-on chip semiconductor device having peripheral bond pads Grant 5,381,036 - Bigler , et al. January 10, 1	1995-01-10
Method for encapsulating semiconductor devices with package bodies Grant 5,344,600 - McShane , et al. September 6, 1	1994-09-06
Lead-on-chip semiconductor device and method for making the same Grant 5,311,057 - McShane May 10, 1	1994-05-10
Semiconductor device having thin package body and method for making the same Grant 5,294,827 - McShane March 15, 1	1994-03-15
Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film Grant 5,273,938 - Lin , et al. December 28, 1	1993-12-28
Stacking three dimensional leadless multi-chip module and method for making the same Grant 5,247,423 - Lin , et al. September 21, 1	1993-09-21
Overmolded semiconductor device having solder ball and edge lead connective structure Grant 5,239,198 - Lin , et al. August 24, 1	1993-08-24
Semiconductor device having a multilayer leadframe with full power and ground planes Grant 5,220,195 - McShane , et al. June 15, 1	1993-06-15
Semiconductor device having a pad array carrier package Grant 5,216,278 - Lin , et al. June 1, 1	1993-06-01
Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film Grant 5,200,362 - Lin , et al. April 6, 1	1993-04-06
Semiconductor device having dual electrical contact sites Grant 5,157,480 - McShane , et al. October 20, 1	1992-10-20
Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation Grant 5,147,821 - McShane , et al. September 15, 1	1992-09-15
Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation Grant 5,105,259 - McShane , et al. April 14, 1	1992-04-14
Plastic pad array electronic AC device Grant 5,045,914 - Casto , et al. September 3, 1	1991-09-03
Molded electronic package with compression structures Grant 5,041,902 - McShane August 20, 1	1991-08-20
TAB tape translator for use with semiconductor devices Grant 5,029,325 - Higgins, III , et al. July 2, 1	1991-07-02
Thin, molded, surface mount electronic device Grant 5,018,005 - Lin , et al. May 21, 1	1991-05-21
High performance overmolded electronic package Grant 5,012,386 - McShane , et al. April 30, 1	1991-04-30
Packaged semiconductor device having a low cost ceramic PGA package Grant 5,006,922 - McShane , et al. April 9, 1	1991-04-09
Flagless semiconductor package Grant 4,924,291 - Lesk , et al. May 8, 1	1990-05-08
Electronic device package with peripheral carrier structure of low-cost plastic Grant 4,897,602 - Lin , et al. January 30, 1	1990-01-30
Process of making an electronic device package with peripheral carrier structure of low-cost plastic Grant 4,837,184 - Lin , et al. June 6, 1	1989-06-06
Low cost integrated circuit bonding process Grant 4,661,192 - McShane April 28, 1	1987-04-28