McPherson; Dale S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for McPherson; Dale S..The latest application filed is for "electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates".

Company Profile

3.7.16

McPherson; Dale S. - Kissimmee FL
McPherson; Dale S. - Burbank CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates App 20200354848 - Cohen; Adam L. ; et al.	2020-11-12
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates Grant 10,676,836 - Cohen , et al.	2020-06-09
Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates App 20190017189 - Cohen; Adam L. ; et al.	2019-01-17
Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates App 20170247807 - Cohen; Adam L. ; et al.	2017-08-31
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates Grant 9,546,431 - Cohen , et al. January 17, 2	2017-01-17
Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates App 20140209473 - Cohen; Adam L. ; et al.	2014-07-31
Multi-step release method for electrochemically fabricated structures Grant 8,512,578 - Cohen , et al. August 20, 2	2013-08-20
Multi-Step Release Method for Electrochemically Fabricated Structures App 20110073479 - Cohen; Adam L. ; et al.	2011-03-31
Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates App 20100270165 - Cohen; Adam L. ; et al.	2010-10-28
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates Grant 7,524,427 - Cohen , et al. April 28, 2	2009-04-28
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates Grant 7,517,462 - Cohen , et al. April 14, 2	2009-04-14
Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates App 20080121343 - Cohen; Adam L. ; et al.	2008-05-29
Multi-step Release Method for Electrochemically Fabricated Structures App 20080105646 - Cohen; Adam L. ; et al.	2008-05-08
Multistep release method for electrochemically fabricated structures Grant 7,303,663 - Cohen , et al. December 4, 2	2007-12-04
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates App 20050230261 - Cohen, Adam L. ; et al.	2005-10-20
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates App 20050215046 - Cohen, Adam L. ; et al.	2005-09-29
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates App 20050199583 - Cohen, Adam L. ; et al.	2005-09-15
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates App 20050194258 - Cohen, Adam L. ; et al.	2005-09-08
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates App 20050173374 - Cohen, Adam L. ; et al.	2005-08-11
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates App 20050176238 - Cohen, Adam L. ; et al.	2005-08-11
Multi-step release method for electrochemically fabricated structures App 20050072681 - Cohen, Adam L. ; et al.	2005-04-07
Multistep release method for electrochemically fabricated structures App 20040007468 - Cohen, Adam L. ; et al.	2004-01-15

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