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Patent applications and USPTO patent grants for McMillan; John Robert.The latest application filed is for "pre-bonded substrate for integrated circuit package and method of making the same".
Patent | Date |
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Pre-bonded substrate for integrated circuit package and method of making the same Grant 8,569,110 - McMillan , et al. October 29, 2 | 2013-10-29 |
Pre-bonded substrate for integrated circuit package and method of making the same Grant 8,513,786 - McMillan , et al. August 20, 2 | 2013-08-20 |
Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof Grant 8,338,924 - McMillan , et al. December 25, 2 | 2012-12-25 |
Pre-bonded Substrate For Integrated Circuit Package And Method Of Making The Same App 20120146200 - MCMILLAN; John Robert ;   et al. | 2012-06-14 |
Substrate For Integrated Circuit Package With Selective Exposure Of Bonding Compound And Method Of Making Thereof App 20120146199 - MCMILLAN; John Robert ;   et al. | 2012-06-14 |
Pre-bonded Substrate For Integrated Circuit Package And Method Of Making The Same App 20120149154 - MCMILLAN; John Robert ;   et al. | 2012-06-14 |
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