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Patent applications and USPTO patent grants for McMillan; John R..The latest application filed is for "printed circuit board with integral heat sink for semiconductor package".
Patent | Date |
---|---|
Printed circuit board with integral heat sink for semiconductor package Grant 6,507,102 - Juskey , et al. January 14, 2 | 2003-01-14 |
Printed circuit board with integral heat sink for semiconductor package App 20020043402 - Juskey, Frank J. ;   et al. | 2002-04-18 |
Low-cost printed circuit board with integral heat sink for semiconductor package Grant 6,337,228 - Juskey , et al. January 8, 2 | 2002-01-08 |
Socket assembly for integrated circuit chip carrier package Grant 5,829,988 - McMillan , et al. November 3, 1 | 1998-11-03 |
Homogeneous chip carrier package Grant 5,827,999 - McMillan , et al. October 27, 1 | 1998-10-27 |
Thermally enhanced chip carrier package Grant 5,650,593 - McMillan , et al. July 22, 1 | 1997-07-22 |
Quick attachment assembly for loader implements Grant 5,252,022 - Culp , et al. October 12, 1 | 1993-10-12 |
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