mcleod mark h

Patent Applications and Registrations

Patent applications and USPTO patent grants for mcleod mark h.The latest application filed is for "ims (injection molded solder) with two resist layers for forming solder bumps on substrates".

Company Profile

2.8.3

- Poughkeepsie NY US
McLeod; Mark H. - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
IMS (injection molded solder) with two resist layers forming solder bumps on substrates Grant 08921221 -	2014-12-30
IMS (injection molded solder) with two resist layers forming solder bumps on substrates Grant 8,921,221 - McLeod , et al. December 30, 2	2014-12-30
Forming constant diameter spherical metal balls Grant 8,875,978 - Feger , et al. November 4, 2	2014-11-04
Injection molded solder process for forming solder bumps on substrates Grant 8,820,612 - Feger , et al. September 2, 2	2014-09-02
Injection molded solder process for forming solder bumps on substrates Grant 8,496,159 - Feger , et al. July 30, 2	2013-07-30
Ims (injection Molded Solder) With Two Resist Layers For Forming Solder Bumps On Substrates App 20120318855 - McLeod; Mark H. ; et al.	2012-12-20
Injection Molded Solder Process For Forming Solder Bumps On Substrates App 20120305633 - Feger; Claudius ; et al.	2012-12-06
Injection Molded Solder Process For Forming Solder Bumps On Substrates App 20120305631 - Feger; Claudius ; et al.	2012-12-06
Multiple radial finger contact cooling device Grant 5,159,531 - Horvath , et al. October 27, 1	1992-10-27

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