name:-0.010064840316772
name:-0.009425163269043
name:-0.0028109550476074
McLaughlin; William Patent Filings

McLaughlin; William

Patent Applications and Registrations

Patent applications and USPTO patent grants for McLaughlin; William.The latest application filed is for "techniques for automatically removing content from closed-caption data embedded in a video signal".

Company Profile
1.11.8
  • McLaughlin; William - Brooklyn NY
  • McLaughlin; William - South Bend IN US
  • McLaughlin; William - Espoo FI
  • McLaughlin; William - North Palm Beach FL
  • McLaughlin; William - Anaheim CA
  • McLaughlin; William - Myrtle Beach SC
  • McLaughlin; William - Washington DC
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Techniques for automatically removing content from closed-caption data embedded in a video signal
Grant 11,356,721 - Strein , et al. June 7, 2
2022-06-07
Techniques For Automatically Removing Content From Closed-caption Data Embedded In A Video Signal
App 20200260129 - A1
2020-08-13
Versatile subject bed
Grant 10,632,271 - Leevy , et al.
2020-04-28
Etch resistant alumina based coatings
Grant 10,510,551 - Rantala , et al. Dec
2019-12-17
Etch Resistant Alumina Based Coatings
App 20170200615 - Rantala; Juha T. ;   et al.
2017-07-13
Etch resistant alumina based coatings
Grant 9,564,339 - Rantala , et al. February 7, 2
2017-02-07
Etch Resistant Alumina Based Coatings
App 20130143408 - Rantala; Juha T ;   et al.
2013-06-06
Top access leveler assembly
Grant 8,328,149 - McLaughlin December 11, 2
2012-12-11
Top Access Leveler Assembly
App 20110203495 - McLaughlin; William
2011-08-25
Method of forming low-k dielectrics using a rapid curing process
Grant 7,622,399 - Reid , et al. November 24, 2
2009-11-24
Dielectric materials and methods for integrated circuit applications
App 20090278254 - Rantala; Juha T. ;   et al.
2009-11-12
Method of forming low-k dielectrics
App 20050064726 - Reid, Jason ;   et al.
2005-03-24
Dielectric materials and methods for integrated circuit applications
App 20050032357 - Rantala, Juha T. ;   et al.
2005-02-10
Li reclamation process
Grant 5,888,463 - McLaughlin , et al. March 30, 1
1999-03-30
Method of terminating lead filled capacitor
Grant 4,881,308 - McLaughlin , et al. November 21, 1
1989-11-21
Drug activation by radiation
Grant 4,202,323 - Zweig , et al. May 13, 1
1980-05-13

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