McLaughlin; Karen P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for McLaughlin; Karen P..The latest application filed is for "flip chip packaging rework".
- McLaughlin; Karen P. - Poughkeepsie NY
| Patent | Date |
|---|---|
| Flip chip packaging rework Grant 11,121,101 - Arvin , et al. September 14, 2 | 2021-09-14 |
| Flip Chip Packaging Rework App 20210242146 - Arvin; Charles Leon ; et al. | 2021-08-05 |
| Bridge support structure Grant 10,957,650 - Arvin , et al. March 23, 2 | 2021-03-23 |
| Bridge Support Structure App 20210057341 - Arvin; Charles L. ; et al. | 2021-02-25 |
| Determining crackstop strength of integrated circuit assembly at the wafer level Grant 9,947,598 - Tunga , et al. April 17, 2 | 2018-04-17 |
| Dual layer stack for contact formation Grant 9,401,336 - Arvin , et al. July 26, 2 | 2016-07-26 |
| Dual Layer Stack For Contact Formation App 20160126201 - Arvin; Charles L. ; et al. | 2016-05-05 |
| Semiconductor Device Including Passivation Layer Encapsulant App 20160035641 - Erwin; Brian M. ; et al. | 2016-02-04 |
| Semiconductor device including passivation layer encapsulant Grant 9,214,385 - Erwin , et al. December 15, 2 | 2015-12-15 |
| Far back end of the line metallization method and structures Grant 8,937,009 - Daubenspeck , et al. January 20, 2 | 2015-01-20 |
| Far Back End Of The Line Metallization Method And Structures App 20140319522 - Daubenspeck; Timothy H. ; et al. | 2014-10-30 |
| Semiconductor Device Including Passivation Layer Encapsulant App 20140183757 - Erwin; Brian M. ; et al. | 2014-07-03 |
| Apparatus and method for plating pin grid array packaging modules Grant 5,869,139 - Biggs , et al. February 9, 1 | 1999-02-09 |
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