McKenney; Darryl J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for McKenney; Darryl J..The latest application filed is for "soldered interconnect for a printed circuit board having an angular radial feature".
- McKenney; Darryl J. - Londonderry NH
- McKenney; Darryl J. - Milford NH
| Patent | Date |
|---|---|
| Soldered interconnect for a printed circuit board having an angular radial feature Grant 10,096,915 - McKenney , et al. October 9, 2 | 2018-10-09 |
| Radio frequency connector and assembly having micro-via radial interconnect Grant 9,761,972 - Beucler , et al. September 12, 2 | 2017-09-12 |
| Soldered Interconnect For A Printed Circuit Board Having An Angular Radial Feature App 20170244184 - MCKENNEY; Darryl J. ; et al. | 2017-08-24 |
| Radio Frequency Connector And Assembly Having Micro-via Radial Interconnect App 20170149156 - BEUCLER; Philip ; et al. | 2017-05-25 |
| Soldered Interconnect For A Printed Circuit Board Having An Angular Radial Feature App 20170149154 - MCKENNEY; Darryl J. ; et al. | 2017-05-25 |
| Soldered Interconnect For A Printed Circuit Board Having An Angular Radial Feature App 20170149155 - MCKENNEY; Darryl J. ; et al. | 2017-05-25 |
| Air-flow-by cooling technology and air-flow-by circuit board modules Grant 9,389,654 - McKenney , et al. July 12, 2 | 2016-07-12 |
| Slot and memory module for a slot standing interconnect Grant 9,128,679 - McKenney , et al. September 8, 2 | 2015-09-08 |
| Electrical contact Grant 9,033,750 - Miller , et al. May 19, 2 | 2015-05-19 |
| Air-flow-by Cooling Technology And Air-flow-by Circuit Board Modules App 20140160670 - McKenney; Darryl J. ; et al. | 2014-06-12 |
| Electrical Contact App 20140051294 - Miller; Keith Edwin ; et al. | 2014-02-20 |
| Slot And Memory Module For A Slot Standing Interconnect App 20130058050 - MCKENNEY; Darryl J. ; et al. | 2013-03-07 |
| Rugged Chip Packaging App 20080280463 - McKenney; Darryl J. ; et al. | 2008-11-13 |
| Manufacture of flexible printed circuit boards App 20040040148 - DeMaso, Arthur ; et al. | 2004-03-04 |
| Controlled impedance extruded flat ribbon cable Grant 6,689,958 - McKenney , et al. February 10, 2 | 2004-02-10 |
| Extruded flat cable App 20040011553 - Cianciolo, David ; et al. | 2004-01-22 |
| Controlled Impedance Extruded Flat Ribbon Cable App 20040011552 - McKenney, Darryl J. ; et al. | 2004-01-22 |
| Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards Grant 6,645,549 - McKenney , et al. November 11, 2 | 2003-11-11 |
| Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same Grant 5,262,594 - Edwin , et al. November 16, 1 | 1993-11-16 |
| Rigid-flex printed circuit Grant 5,175,047 - McKenney , et al. December 29, 1 | 1992-12-29 |
| Process of forming a rigid-flex circuit Grant 5,095,628 - McKenney , et al. March 17, 1 | 1992-03-17 |
| Multilayer combined rigid and flex printed circuits Grant 4,800,461 - Dixon , et al. January 24, 1 | 1989-01-24 |
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