McIver; Chandler H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for McIver; Chandler H..The latest application filed is for "low profile small outline leadless semiconductor device package".
- McIver; Chandler H. - Temple AZ
- McIver; Chandler H. - Tempe AZ
| Patent | Date |
|---|---|
| Low profile small outline leadless semiconductor device package App 20060201709 - McIver; Chandler H. | 2006-09-14 |
| Shelf support Grant D415,015 - Pare , et al. October 12, 1 | 1999-10-12 |
| Multichip semiconductor small outline integrated circuit package structure Grant 5,337,216 - McIver August 9, 1 | 1994-08-09 |
| Pretestable double-sided tab design Grant 4,772,936 - Reding , et al. September 20, 1 | 1988-09-20 |
| Integrated circuit package Grant 4,437,235 - McIver * March 20, 1 | 1984-03-20 |
| Integrated circuit chip package with improved cooling means Grant 4,396,936 - McIver , et al. August 2, 1 | 1983-08-02 |
| Method of mounting an I.C. chip on a substrate Grant 4,381,602 - McIver May 3, 1 | 1983-05-03 |
| Integrated circuit package Grant 4,363,076 - McIver December 7, 1 | 1982-12-07 |
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