McGahay; Vincent J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for McGahay; Vincent J..The latest application filed is for "method to form air gap structure with dual dielectric layer".

Company Profile

9.56.61

McGahay; Vincent J. - Poughkeepsie NY
McGahay; Vincent J. - Hopewell Junction NY
McGahay; Vincent J - Poughkeepsie NY
McGahay; Vincent J. - Pougkeepsie NY
McGahay, Vincent J. - Poughkeepsier NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method To Form Air Gap Structure With Dual Dielectric Layer App 20210358840 - McGahay; Vincent J. ; et al.	2021-11-18
Dual dielectric layer for closing seam in air gap structure Grant 11,127,678 - McGahay , et al. September 21, 2	2021-09-21
Dual Dielectric Layer For Closing Seam In Air Gap Structure App 20210175166 - McGahay; Vincent J. ; et al.	2021-06-10
Artificially Oriented Piezoelectric Film For Integrated Filters App 20200036363 - McGahay; Vincent J. ; et al.	2020-01-30
Seal ring structure of integrated circuit and method of forming same Grant 10,546,822 - Polomoff , et al. Ja	2020-01-28
Time temperature monitoring system Grant 10,504,807 - Davis , et al. Dec	2019-12-10
Artificially oriented piezoelectric film for integrated filters Grant 10,483,943 - McGahay , et al. Nov	2019-11-19
Arc-resistant crackstop Grant 10,438,902 - McGahay , et al. O	2019-10-08
Arc-resistant Crackstop App 20190074253 - MCGAHAY; Vincent J. ; et al.	2019-03-07
Seal Ring Structure Of Integrated Circuit And Method Of Forming Same App 20190067210 - Polomoff; Nicholas A. ; et al.	2019-02-28
Time temperature monitoring system Grant 10,217,682 - Davis , et al. Feb	2019-02-26
Multiple-depth trench interconnect technology at advanced semiconductor nodes Grant 10,169,525 - Greco , et al. J	2019-01-01
Artificially Oriented Piezoelectric Film For Integrated Filters App 20180375494 - McGahay; Vincent J. ; et al.	2018-12-27
Time Temperature Monitoring System App 20180350702 - Davis; Taryn J. ; et al.	2018-12-06
Crackstop structures Grant 10,109,600 - McGahay , et al. October 23, 2	2018-10-23
Segmented Guard-ring And Chip Edge Seals App 20180248001 - STAMPER; Anthony K. ; et al.	2018-08-30
Electrical circuit odometer sensor array Grant 10,060,974 - Fry , et al. August 28, 2	2018-08-28
Segmented guard-ring and chip edge seals Grant 10,062,748 - Stamper , et al. August 28, 2	2018-08-28
Time Temperature Monitoring System App 20180226308 - Davis; Taryn J. ; et al.	2018-08-09
Time temperature monitoring system Grant 10,032,683 - Davis , et al. July 24, 2	2018-07-24
Multiple-depth Trench Interconnect Technology At Advanced Semiconductor Nodes App 20170277823 - Greco; Stephen E. ; et al.	2017-09-28
Multiple-depth trench interconnect technology at advanced semiconductor nodes Grant 9,710,592 - Greco , et al. July 18, 2	2017-07-18
Time Temperature Monitoring System App 20160372391 - Davis; Taryn J. ; et al.	2016-12-22
Integrated circuit barrierless microfluidic channel Grant 9,502,325 - Clevenger , et al. November 22, 2	2016-11-22
Stitch-derived via structures and methods of generating the same Grant 9,454,631 - Greco , et al. September 27, 2	2016-09-27
Method and structure for determining thermal cycle reliability Grant 9,443,776 - Filippi , et al. September 13, 2	2016-09-13
Integrated Circuit Barrierless Microfluidic Channel App 20160254208 - Clevenger; Lawrence A. ; et al.	2016-09-01
Integrated circuit barrierless microfluidic channel Grant 9,385,062 - Clevenger , et al. July 5, 2	2016-07-05
Electrical Circuit Odometer Sensor Array App 20160178694 - Fry; Jonathan R. ; et al.	2016-06-23
Integrated Circuit Barrierless Microfluidic Channel App 20160181153 - Clevenger; Lawrence A. ; et al.	2016-06-23
Integrated Circuit Barrierless Microfluidic Channel App 20160181173 - Clevenger; Lawrence A. ; et al.	2016-06-23
Integrated circuit barrierless microfluidic channel Grant 9,373,561 - Clevenger , et al. June 21, 2	2016-06-21
Methods to form conductive thin film structures Grant 9,362,230 - Clevenger , et al. June 7, 2	2016-06-07
Method and structure for determining thermal cycle reliability Grant 9,287,186 - Filippi , et al. March 15, 2	2016-03-15
Multiple-depth Trench Interconnect Technology At Advancedsemiconductor Nodes App 20160042114 - Greco; Stephen E. ; et al.	2016-02-11
Stitch-derived Via Structures And Methods Of Generating The Same App 20150339422 - Greco; Stephen E. ; et al.	2015-11-26
Method And Structure For Determining Thermal Cycle Reliability App 20150262899 - FILIPPI; RONALD G. ; et al.	2015-09-17
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 8,343,868 - Edelstein , et al. January 1, 2	2013-01-01
Deep trench crackstops under contacts Grant 8,237,246 - Angyal , et al. August 7, 2	2012-08-07
Semiconductor article having a through silicon via and guard ring Grant 8,232,648 - McGahay , et al. July 31, 2	2012-07-31
Reducing effective dielectric constant in semiconductor devices Grant 8,129,286 - Edelstein , et al. March 6, 2	2012-03-06
Semiconductor Article Having A Through Silicon Via And Guard Ring App 20110291279 - McGahay; Vincent J. ; et al.	2011-12-01
Integrated circuit having resistor between BEOL interconnect and FEOL structure and related method Grant 8,013,394 - Chinthakindi , et al. September 6, 2	2011-09-06
Run-time dispatch system for enhanced product characterization capability Grant 7,979,151 - McGahay July 12, 2	2011-07-12
Method to create region specific exposure in a layer Grant 7,977,032 - Dimitrakopoulos , et al. July 12, 2	2011-07-12
Reliable BEOL integration process with direct CMP of porous SiCOH dielectric Grant 7,948,083 - Dimitrakopoulos , et al. May 24, 2	2011-05-24
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20110111590 - Edelstein; Daniel C. ; et al.	2011-05-12
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,892,940 - Edelstein , et al. February 22, 2	2011-02-22
Deep Trench Crackstops Under Contacts App 20100200960 - Angyal; Matthew S. ; et al.	2010-08-12
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,592,685 - Edelstein , et al. September 22, 2	2009-09-22
Run-time Dispatch System For Enhanced Product Characterization Capability App 20090149979 - McGahay; Vincent J.	2009-06-11
Method to create air gaps using non-plasma processes to damage ILD materials Grant 7,531,444 - Dimitrakopoulos , et al. May 12, 2	2009-05-12
Hardmask for improved reliability of silicon based dielectrics Grant 7,485,582 - Nguyen , et al. February 3, 2	2009-02-03
Method to improve time dependent dielectric breakdown Grant 7,473,636 - Chanda , et al. January 6, 2	2009-01-06
Building metal pillars in a chip for structure support Grant 7,456,098 - Hichri , et al. November 25, 2	2008-11-25
Method and structure for integrating MIM capacitors within dual damascene processing techniques Grant 7,439,151 - Coolbaugh , et al. October 21, 2	2008-10-21
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080254630 - EDELSTEIN; Daniel C. ; et al.	2008-10-16
Integrated Circuit Having Resistor Between Beol Interconnect And Feol Structure And Related Method App 20080237800 - CHINTHAKINDI; ANIL K. ; et al.	2008-10-02
Method And Structure For Determining Thermal Cycle Reliability App 20080224135 - Filippi; Ronald Gene ; et al.	2008-09-18
Method And Structure For Integrating Mim Capacitors Within Dual Damascene Processing Techniques App 20080185684 - Coolbaugh; Douglas D. ; et al.	2008-08-07
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,405,147 - Edelstein , et al. July 29, 2	2008-07-29
Structure for determining thermal cycle reliability Grant 7,388,224 - Filippi , et al. June 17, 2	2008-06-17
Hardmask For Improved Reliability Of Silicon Based Dielectrics App 20080132055 - Nguyen; Son Van ; et al.	2008-06-05
Hardmask For Improved Reliability Of Silicon Based Dielectrics App 20080118717 - Nguyen; Son Van ; et al.	2008-05-22
Control of liner thickness for improving thermal cycle reliability Grant 7,345,305 - Filippi , et al. March 18, 2	2008-03-18
Method And Structure For Integrating Mim Capacitors Within Dual Damascene Processing Techniques App 20080064163 - Coolbaugh; Douglas D. ; et al.	2008-03-13
Hardmask for reliability of silicon based dielectrics Grant 7,335,980 - Nguyen , et al. February 26, 2	2008-02-26
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080038915 - EDELSTEIN; Daniel C. ; et al.	2008-02-14
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080038923 - EDELSTEIN; Daniel C. ; et al.	2008-02-14
Full Removal Of Dual Damascene Metal Level App 20070275565 - Cooney; Edward C. III ; et al.	2007-11-29
RELIABLE BEOL INTEGRATION PROCESS WITH DIRECT CMP OF POROUS SiCOH DIELECTRIC App 20070228570 - Dimitrakopoulos; Christos D. ; et al.	2007-10-04
Reducing damage to ulk dielectric during cross-linked polymer removal Grant 7,253,100 - DellaGuardia , et al. August 7, 2	2007-08-07
Reliable BEOL integration process with direct CMP of porous SiCOH dielectric Grant 7,253,105 - Dimitrakopoulos , et al. August 7, 2	2007-08-07
Method to Improve Time Dependent Dielectric Breakdown App 20070158851 - Chanda; Kaushik ; et al.	2007-07-12
Single Or Dual Damascene Via Level Wirings And/or Devices, And Methods Of Fabricating Same App 20070152332 - Chinthakindi; Anil K. ; et al.	2007-07-05
Reducing Damage To Ulk Dielectric During Cross-linked Polymer Removal App 20070111466 - DellaGuardia; Ronald A. ; et al.	2007-05-17
Interlevel dielectric layer and metal layer sealing Grant 7,214,608 - Angyal , et al. May 8, 2	2007-05-08
Preventing Damage To Interlevel Dielectric App 20070072412 - Dunn; Derren N. ; et al.	2007-03-29
Method and structure for determining thermal cycle reliability App 20060273460 - Filippi; Ronald Gene ; et al.	2006-12-07
Crackstop with release layer for crack control in semiconductors Grant 7,109,093 - Fitzsimmons , et al. September 19, 2	2006-09-19
Method and structure for determining thermal cycle reliability Grant 7,098,054 - Filippi , et al. August 29, 2	2006-08-29
Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor Grant 7,098,676 - Landers , et al. August 29, 2	2006-08-29
Reliable BEOL integration process with direct CMP of porous SiCOH dielectric App 20060189133 - Dimitrakopoulos; Christos D. ; et al.	2006-08-24
Building metal pillars in a chip for structure support App 20060190846 - Hichri; Habib ; et al.	2006-08-24
Method To Create Air Gaps Using Non-plasma Processes To Damage Ild Materials App 20060183315 - Dimitrakopoulos; Christos D. ; et al.	2006-08-17
Method To Create Region Specific Exposure In A Layer App 20060183062 - Dimitrakopoulos; Christos D. ; et al.	2006-08-17
Building metal pillars in a chip for structure support Grant 7,067,902 - Hichri , et al. June 27, 2	2006-06-27
Hardmask for improved reliability of silicon based dielectrics App 20060091559 - Nguyen; Son Van ; et al.	2006-05-04
Control of liner thickness for improving thermal cycle reliability App 20060027842 - Filippi; Ronald Gene ; et al.	2006-02-09
Interlevel Dielectric Layer And Metal Layer Sealing App 20060024961 - Angyal; Matthew S. ; et al.	2006-02-02
Control of liner thickness for improving thermal cycle reliability Grant 6,989,282 - Filippi , et al. January 24, 2	2006-01-24
Single and multilevel rework Grant 6,982,227 - Cooney, III , et al. January 3, 2	2006-01-03
Control of liner thickness for improving thermal cycle reliability App 20050227380 - Filippi, Ronald Gene ; et al.	2005-10-13
Crackstop With Release Layer For Crack Control In Semiconductors App 20050208781 - Fitzsimmons, John A. ; et al.	2005-09-22
Method and structure for determining thermal cycle reliability App 20050186689 - Filippi, Ronald Gene ; et al.	2005-08-25
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20050167838 - Edelstein, Daniel C. ; et al.	2005-08-04
Building metal pillars in a chip for structure support App 20050118803 - Hichri, Habib ; et al.	2005-06-02
Plasma Processing Material Reclamation And Reuse App 20050011442 - Chen, Bomy A. ; et al.	2005-01-20
Structure and method for reducing thermo-mechanical stress in stacked vias Grant 6,831,363 - Dalton , et al. December 14, 2	2004-12-14
Full Removal Of Dual Damascene Metal Level App 20040245636 - Cooney, Edward C III ; et al.	2004-12-09
Method for improving adhesion to copper Grant 6,821,890 - McGahay , et al. November 23, 2	2004-11-23
Single and multilevel rework App 20040142565 - Cooney, Edward C. III ; et al.	2004-07-22
Multi-functional structure for enhanced chip manufacturibility & reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor App 20040129938 - Landers, William F. ; et al.	2004-07-08
Structure and method for reducing thermo-mechanical stress in stacked vias App 20040113278 - Dalton, Timothy J. ; et al.	2004-06-17
Dual damascene flowable oxide insulation structure and metallic barrier Grant 6,727,589 - Greco , et al. April 27, 2	2004-04-27
Single and multilevel rework Grant 6,674,168 - Cooney, III , et al. January 6, 2	2004-01-06
Integrated, active, moisture and oxygen getter layers App 20030155655 - Fitzsimmons, John A. ; et al.	2003-08-21
High modulus film structure for enhanced electromigration resistance App 20020132471 - Engel, Brett H. ; et al.	2002-09-19
Method of forming an on-chip decoupling capacitor with bottom hardmask Grant 6,387,754 - Dalton , et al. May 14, 2	2002-05-14
Damascene etchback for low .epsilon. dielectric Grant 6,331,481 - Stamper , et al. December 18, 2	2001-12-18
Method of forming an on-chip decoupling capacitor with bottom hardmask App 20010036753 - Dalton, Timothy J. ; et al.	2001-11-01
Interim oxidation of silsesquioxane dielectric for dual damascene process App 20010036739 - Cook, Robert ; et al.	2001-11-01
Method for improving adhesion to copper App 20010023987 - Mcgahay, Vincent J. ; et al.	2001-09-27
Crackstop and oxygen barrier for low-K dielectric integrated circuits Grant 6,261,945 - Nye, III , et al. July 17, 2	2001-07-17
Dual damascene flowable oxide insulation structure and metallic barrier App 20010000115 - Greco, Stephen E. ; et al.	2001-04-05
Carbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuits Grant 5,530,293 - Cohen , et al. June 25, 1	1996-06-25