McGahay; Vincent

Patent Applications and Registrations

Patent applications and USPTO patent grants for McGahay; Vincent.The latest application filed is for "corrosion resistant chip sidewall connection with crackstop and hermetic seal".

Company Profile

0.9.10

McGahay; Vincent - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Corrosion resistant chip sidewall connection with crackstop and hermetic seal Grant 9,852,959 - Fitzsimmons , et al. December 26, 2	2017-12-26
Corrosion Resistant Chip Sidewall Connection With Crackstop And Hermetic Seal App 20170229362 - Fitzsimmons; John A. ; et al.	2017-08-10
Process for interfacial adhesion in laminate structures through patterned roughing of a surface Grant 7,972,965 - Cooney, III , et al. July 5, 2	2011-07-05
Process For Interfacial Adhesion In Laminate Structures Through Patterned Roughing Of A Surface App 20080020546 - COONEY; Edward C. III ; et al.	2008-01-24
Process for interfacial adhesion in laminate structures through patterned roughing of a surface Grant 7,303,994 - Cooney, III , et al. December 4, 2	2007-12-04
Stacked via-stud with improved reliability in copper metallurgy App 20060014376 - Agarwala; Birendra N. ; et al.	2006-01-19
Process For Interfacial Adhesion In Laminate Structures Through Patterned Roughing Of A Surface App 20050277266 - Cooney, Edward C. III ; et al.	2005-12-15
Stacked via-stud with improved reliability in copper metallurgy Grant 6,972,209 - Agarwala , et al. December 6, 2	2005-12-06
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Grant 6,939,797 - Barth , et al. September 6, 2	2005-09-06
Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof Grant 6,914,320 - Chen , et al. July 5, 2	2005-07-05
Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof Grant 6,887,783 - Chen , et al. May 3, 2	2005-05-03
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof App 20040173908 - Barth, Edward ; et al.	2004-09-09
Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof App 20040173907 - Chen, Tze-Chiang ; et al.	2004-09-09
Stacked via-stud with improved reliability in copper metallurgy App 20040101663 - Agarwala, Birendra N. ; et al.	2004-05-27
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Grant 6,737,747 - Barth , et al. May 18, 2	2004-05-18
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof App 20030132510 - Barth, Edward ; et al.	2003-07-17
Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof App 20030134499 - Chen, Tze-Chiang ; et al.	2003-07-17
Method for forming encapsulated metal interconnect structures in semiconductor integrated circuit devices App 20030116439 - Seo, Soon-Chen ; et al.	2003-06-26
Robust interconnect structure Grant 6,133,136 - Edelstein , et al. October 17, 2	2000-10-17

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