McFeely; Fenton Read

Patent Applications and Registrations

Patent applications and USPTO patent grants for McFeely; Fenton Read.The latest application filed is for "method to fabricate copper wiring structures and structures formed thereby".

Company Profile

0.19.19

McFeely; Fenton Read - Ossining NY
McFeely; Fenton Read - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method to fabricate copper wiring structures and structures formed thereby Grant 9,343,407 - McFeely , et al. May 17, 2	2016-05-17
Method To Fabricate Copper Wiring Structures And Structures Formed Thereby App 20150194385 - McFeely; Fenton Read ; et al.	2015-07-09
Method to fabricate copper wiring structures and structures formed thereby Grant 9,048,296 - McFeely , et al. June 2, 2	2015-06-02
Techniques for forming narrow copper filled vias having improved conductivity Grant 8,661,664 - McFeely , et al. March 4, 2	2014-03-04
Method To Fabricate Copper Wiring Structures And Structures Formed Tehreby App 20120205804 - McFeely; Fenton Read ; et al.	2012-08-16
Method and Structure to Improve the Conductivity of Narrow Copper Filled Vias App 20120012372 - McFeely; Fenton Read ; et al.	2012-01-19
Low Temperature Plasma-Free Method for the Nitridation of Copper App 20110052797 - McFeely; Fenton Read ; et al.	2011-03-03
Multi-Step Method to Selectively Deposit Ruthenium Layers of Arbitrary Thickness on Copper App 20110045171 - McFeely; Fenton Read ; et al.	2011-02-24
Ultra thin, single phase, diffusion barrier for metal conductors Grant 7,172,968 - Cohen , et al. February 6, 2	2007-02-06
Constant emissivity deposition member Grant 7,037,834 - McFeely , et al. May 2, 2	2006-05-02
Method for electroplating on resistive substrates Grant 6,974,531 - Andricacos , et al. December 13, 2	2005-12-13
Tungsten encapsulated copper interconnections using electroplating App 20050269708 - Andricacos, Panayotis C. ; et al.	2005-12-08
Constant emissivity deposition member App 20050260833 - McFeely, Fenton Read ; et al.	2005-11-24
Method for electroplating on resistive substrates App 20050199502 - Andricacos, Panayotis ; et al.	2005-09-15
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof Grant 6,911,229 - Andricacos , et al. June 28, 2	2005-06-28
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof App 20050006777 - Andricacos, Panayotis C. ; et al.	2005-01-13
Process of forming copper structures Grant 6,812,143 - Lane , et al. November 2, 2	2004-11-02
Barrier material for copper structures Grant 6,787,912 - Lane , et al. September 7, 2	2004-09-07
Process of passivating a metal-gated complementary metal oxide semiconductor Grant 6,770,500 - Callegari , et al. August 3, 2	2004-08-03
CMOS-compatible metal-semiconductor-metal photodetector Grant 6,756,651 - Bozso , et al. June 29, 2	2004-06-29
Method for electroplating on resistive substrates App 20040069648 - Andricacos, Panayotis ; et al.	2004-04-15
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof App 20040028882 - Andricacos, Panayotis C. ; et al.	2004-02-12
Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support Grant 6,660,330 - Locke , et al. December 9, 2	2003-12-09
Nitrogen-rich barrier layer and structures formed App 20030203653 - Buchanan, Douglas Andrew ; et al.	2003-10-30
Nitrogen-rich barrier layer and structures formed App 20030190821 - Buchanan, Douglas Andrew ; et al.	2003-10-09
Process of passivating a metal-gated complementary metal oxide semiconductor App 20030186518 - Callegari, Alessandro Cesare ; et al.	2003-10-02
Nitrogen-rich barrier layer and structures formed Grant 6,566,281 - Buchanan , et al. May 20, 2	2003-05-20
CMOS-compatible metal-semiconductor-metal photodetector App 20030057507 - Bozso, Ferenc M. ; et al.	2003-03-27
Ultra thin, single phase, diffusion barrier for metal conductors App 20020175418 - Cohen, Stephan Alan ; et al.	2002-11-28
Deformation-susceptible substrate holder for low-pressure MOCVD and process for use thereof App 20020146903 - Locke, Peter S. ; et al.	2002-10-10
Interfacial oxidation process for high-k gate dielectric process integration Grant 6,444,592 - Ballantine , et al. September 3, 2	2002-09-03
Tungsten encapsulated copper interconnections using electroplating App 20020092673 - Andricacos, Panayotis C. ; et al.	2002-07-18
Method for depositing copper onto a barrier layer Grant 6,416,812 - Andricacos , et al. July 9, 2	2002-07-09
Actively cooled dispenser system for improved resistivity and phase control in metal CVD from organometallic precursors App 20020086529 - McFeely, Fenton Read ; et al.	2002-07-04
Fabrication of mid-cap metal gates compatible with ultra-thin dielectrics Grant 6,091,122 - Buchanan , et al. July 18, 2	2000-07-18
Method of fabricating mid-gap metal gates compatible with ultra-thin dielectrics Grant 5,789,312 - Buchanan , et al. August 4, 1	1998-08-04

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