McElrea; Simon
Patent Applications and Registrations
Patent applications and USPTO patent grants for McElrea; Simon.The latest application filed is for "free positioning multi-device wireless charger".
- McElrea; Simon - Chandler AZ
- McElrea; Simon - Scotts Valley CA
- McElrea; Simon - San Jose CA US
- McElrea, Simon - Trabuco Canyon CA
- McElrea; Simon - Orange CA
- McElrea, Simon - Newport Beach CA
| Patent | Date |
|---|---|
| Free Positioning Multi-device Wireless Charger App 20220311278 - Goodchild; Eric Heindel ; et al. | 2022-09-29 |
| Microelectronic Assembly With Thermally and Electrically Conductive Underfill App 20150017763 - Haba; Belgacem ; et al. | 2015-01-15 |
| Stacked die assembly having reduced stress electrical interconnects Grant 8,912,661 - McGrath , et al. December 16, 2 | 2014-12-16 |
| Through interposer wire bond using low CTE interposer with coarse slot apertures Grant 8,872,318 - McElrea , et al. October 28, 2 | 2014-10-28 |
| Microelectronic assembly with thermally and electrically conductive underfill Grant 8,847,412 - Haba , et al. September 30, 2 | 2014-09-30 |
| Microelectronic Assembly With Thermally And Electrically Conductive Underfill App 20140131900 - Haba; Belgacem ; et al. | 2014-05-15 |
| Through Interposer Wire Bond Using Low Cte Interposer With Coarse Slot Apertures App 20130049196 - McElrea; Simon ; et al. | 2013-02-28 |
| Multi-layer interconnect App 20040124534 - Pommer, Richard ; et al. | 2004-07-01 |
| Method of making a multi-layer interconnect Grant 6,607,939 - Pommer , et al. August 19, 2 | 2003-08-19 |
| Multi-layer interconnect App 20020092159 - Pommer, Richard ; et al. | 2002-07-18 |
| Multi-layer Interconnect App 20020003303 - POMMER, RICHARD ; et al. | 2002-01-10 |
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