McDonough; Colin
Patent Applications and Registrations
Patent applications and USPTO patent grants for McDonough; Colin.The latest application filed is for "apparatus and method for thin die-to-wafer bonding".
- McDonough; Colin - Albany NY US
| Patent | Date |
|---|---|
| Apparatus and method for integration of through substrate vias Grant 8,969,200 - Hebding , et al. March 3, 2 | 2015-03-03 |
| Method for thin die-to-wafer bonding Grant 8,697,542 - Pascual , et al. April 15, 2 | 2014-04-15 |
| Apparatus And Method For Integration Of Through Substrate Vias App 20130270711 - HEBDING; Jeremiah ; et al. | 2013-10-17 |
| Apparatus And Method For Thin Die-to-wafer Bonding App 20130273691 - PASCUAL; Daniel ; et al. | 2013-10-17 |
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